HIGH VOLTAGE POWER MODULE
First Claim
1. A power module comprising:
- a first sub-module comprising a first power semiconductor die;
a second sub-module comprising a second power semiconductor die; and
a removable jumper coupled between at least one contact of the first power semiconductor die and at least one contact of the second power semiconductor die.
5 Assignments
0 Petitions
Accused Products
Abstract
A power module includes a number of sub-modules connected via removable jumpers. The removable jumpers allow the connections between one or more power semiconductor die in the sub-modules to be reconfigured, such that when the removable jumpers are provided, the power module has a first function and when the removable jumpers are removed, the power module has a second function. The removable jumpers may also allow for independent testing of the sub-modules. The power module may also include a multi-layer printed circuit board (PCB), which is used to connect one or more contacts of the power semiconductor die. The multi-layer PCB reduces stray inductance between the contacts and therefore improves the performance of the power module.
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Citations
20 Claims
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1. A power module comprising:
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a first sub-module comprising a first power semiconductor die; a second sub-module comprising a second power semiconductor die; and a removable jumper coupled between at least one contact of the first power semiconductor die and at least one contact of the second power semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A power module comprising:
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a first power semiconductor die comprising a first contact and a second contact; a second power semiconductor die comprising a first contact and a second contact; and a multi-layer printed circuit board (PCB) coupled between the first power semiconductor die and the second power semiconductor die such that; a first conductive layer of the multi-layer PCB is coupled between the first contact of the first power semiconductor die and the first contact of the second power semiconductor die; a second conductive layer of the multi-layer PCB is coupled between the second contact of the first power semiconductor die and the second contact of the second power semiconductor die; and the first conductive layer and the second conductive layer are separated by an insulating layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification