MASK MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
First Claim
1. A method comprising:
- designing a layout of a main pattern;
performing integrated optical proximity correction (OPC) on the layout;
obtaining design data from the result of the integrated OPC;
delivering the design data as mask tape-out (MTO) design data;
preparing mask data, based on the MTO design data; and
exposing a substrate to form a mask, based on the mask data,wherein the performing of the integrated OPC comprises generating a dummy pattern in a state of maintaining hierarchical structure.
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Abstract
A mask manufacturing method and a semiconductor device manufacturing method are provided. The methods form a plurality of dummy patterns without any change in hierarchical structure to reduce a turn-around time (TAT) and a performance of a system. The mask manufacturing method includes designing a layout of a main pattern, performing integrated optical proximity correction (OPC) on the layout, delivering design data, obtained through the integrated OPC, as mask tape-out (MTO) design data, preparing mask data based on the MTO design data, and exposing a substrate for a mask, based on the mask data, wherein the performing of the integrated OPC includes generating a dummy pattern in a state of maintaining hierarchical structure.
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Citations
20 Claims
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1. A method comprising:
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designing a layout of a main pattern; performing integrated optical proximity correction (OPC) on the layout; obtaining design data from the result of the integrated OPC; delivering the design data as mask tape-out (MTO) design data; preparing mask data, based on the MTO design data; and exposing a substrate to form a mask, based on the mask data, wherein the performing of the integrated OPC comprises generating a dummy pattern in a state of maintaining hierarchical structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a semiconductor device, the method comprising:
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designing a layout of a main pattern; receiving data corresponding to the layout; performing integrated optical proximity correction (OPC) including generating a dummy pattern in a state of maintaining a hierarchical structure and generating design data; delivering the design data as mask tape-out (MTO) design data; preparing mask data, based on the MTO design data; exposing a substrate to form a mask, based on the mask data; and forming a semiconductor device through a lithography process using the mask. - View Dependent Claims (12, 13, 14)
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15. A method, comprising;
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designing a layout of main patterns of a mask; determining the layout into a plurality of templates based on the structure of the layout; generating dummy patterns in the respective templates; performing optical proximity correction in the patterns of the respective templates; delivering mask tape-out design data based on the result of the optical proximity correction; and forming a photomask with the mask tape-out design data. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification