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Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ

  • US 20170115657A1
  • Filed: 10/22/2015
  • Published: 04/27/2017
  • Est. Priority Date: 10/22/2015
  • Status: Abandoned Application
First Claim
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1. A cluster tool assembly, comprising:

  • a vacuum transfer module;

    a process module having a first side connected to the vacuum transfer module;

    an isolation valve having a first side coupled to a second side of the process module; and

    a replacement station coupled to a second side of the isolation valve, the replacement station including an exchange handler and a part buffer, the part buffer includes a plurality of compartments for holding new or used consumable parts;

    the process module having a lift mechanism to enable placement of a consumable part installed in the process module to a raised position, the raised position providing access to the exchange handler to enable removal of the consumable part from the process module and storage to a compartment of the part buffer,the exchange handler of the replacement station enabled to install a replacement for the consumable part from the part buffer back to the process module;

    wherein the lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position;

    wherein the replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

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