Automated Replacement of Consumable Parts Using Interfacing Chambers

• US 20170117172A1
• Filed: 02/19/2016
• Published: 04/27/2017
• Est. Priority Date: 10/22/2015
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Genetti, Damon Tyrone, McChesney, Jon, Paterson, Alex, Witkowicki, Derek John, Ngo, Austin
• Granted Patent: US 10,062,599 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support

Abstract

A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module. The lift mechanism is configured to receive the consumable part provided for replacement by the exchange handler and lower the consumable part to an installed position. The replacement by the exchange handler and the process module is conducted while the process module and the replacement station are maintained in a vacuum state.

Claims

1. A loadlock chamber disposed within a cluster tool assembly used for processing a substrate, the cluster tool assembly having an atmospheric transfer module, a vacuum transfer module and a process module, the loadlock chamber disposed between the atmospheric transfer module and the vacuum transfer module, the loadlock chamber comprising:

a support mechanism having a plurality of finger assemblies, each one of the plurality of finger assemblies includes a top support finger and a bottom support finger, the top and the bottom support fingers having a first end and a second end, a top surface of the bottom support finger includes an indent defined proximal to the second end and between the first end and the second end;

a spacer block disposed between the top support finger and the bottom support finger at the first end,

a second spacer block disposed below the bottom support finger at the first end;

a substrate contact pad is disposed on the top surface of the top and the bottom support fingers at the second end proximal to a tip of the top and bottom support fingers; and

a consumable contact pad is disposed in the indent, the consumable contact pad being disposed between the substrate contact pad disposed in the bottom support finger and the first end of the bottom support finger,

wherein the plurality of finger assemblies are configured to transport both a consumable part using the consumable contact pad and a substrate using the substrate contact pad.

2. The loadlock chamber of claim 1, wherein the consumable contact pad is disposed outside of a diameter of the substrate.

3. The loadlock chamber of claim 1, wherein the substrate contact pad is disposed inside of a diameter of the substrate.

4. The loadlock chamber of claim 1, further includes a second consumable contact pad disposed in the indent of the bottom support finger adjacent to the consumable contact pad and between the consumable contact pad and the first end of the bottom support finger.

5. The loadlock chamber of claim 4, wherein the second consumable contact pad is disposed outside of a diameter of the substrate.

6. The loadlock chamber of claim 1, wherein the consumable contact pad and the substrate contact pad are made of elastomeric material.

7. The loadlock chamber of claim 1, wherein the loadlock chamber is disposed between the atmospheric transfer module and the vacuum transfer module, the loadlock chamber providing an interface between the atmospheric and the vacuum transfer modules.

8. A cluster tool assembly having an atmospheric transfer module, a vacuum transfer module, a loadlock chamber and a process module, the cluster tool assembly comprising:

the atmospheric transfer module having a first robot;

a replacement station coupled to a first side of the atmospheric transfer module, the replacement station having a part buffer with a plurality of compartments to store new or used consumable parts;

a loadlock chamber coupled to a second side of the atmospheric transfer module and a first side of the vacuum transfer module, the loadlock chamber providing an interface between the atmospheric transfer module and the vacuum transfer module; and

wherein the first robot includes a first end-effector mechanism, the first end-effector mechanism of the first robot includes,

a wrist plate;

a mounting armset connected to the wrist plate;

a finger assembly mounted to the mounting armset and includes a pair of fingers extending outward from the mounting armset, the finger assembly having a proximal end proximal to the mounting armset and a distal end defined at tips of the pair of fingers;

a first carrier contact pad disposed on a top surface of the finger assembly proximal to a center of a fork defined by the pair of fingers; and

a second pair of carrier contact pads disposed on the top surface of the finger assembly and located proximal to the distal end of the finger assembly,

wherein the finger assembly is configured to transport a substrate and support a carrier plate using the first carrier and the second pair of carrier contact pads, wherein the carrier plate is configured to support a consumable part.

9. The cluster tool assembly of claim 8, wherein the carrier plate is triangular in shape, the carrier plate includes a consumable contact pad that is disposed at each apex of the carrier plate such that a distance of the consumable contact pad disposed at each apex from a center of the carrier plate is outside a radius of the substrate.

10. The cluster tool assembly of claim 8, wherein the replacement station includes a housing to store the carrier plate.

11. The cluster tool assembly of claim 8, wherein the replacement station includes a separator plate to separate select ones of the plurality of compartments that store new consumable parts from other ones of the plurality of compartments that store used consumable parts, wherein the replacement station includes a housing defined over the separator plate to store the carrier plate.

12. The cluster tool assembly of claim 11, wherein the replacement station includes a second housing for storing a second carrier plate, the second housing defined below the separator plate, wherein the compartments below the separator plate are used to store used consumable parts.

13. The cluster tool assembly of claim 8, wherein the process module is coupled to the second side of the vacuum transfer module, and wherein access from the vacuum transfer module to the process module is through a gate valve that is operated using a sensor mechanism.

14. The cluster tool assembly of claim 8, wherein the vacuum transfer module includes a second robot, the second robot having a second end-effector mechanism, the second end-effector mechanism of the second robot includes,

the wrist plate;

the mounting armset connected to the wrist plate, the mounting armset having a top plate and a bottom plate;

a finger assembly clamped between the top plate and the bottom plate of the mounting armset, the finger assembly includes a pair of fingers extending outward from the mounting armset, the finger assembly having the proximal end adjacent to the mounting armset and the distal end at tips of the pair of fingers;

a first pair of consumable contact pads disposed on a top surface of the finger assembly and located at the proximal end of the finger assembly;

a second pair of consumable contact pads disposed on the top surface of the finger assembly and located at the distal end of the finger assembly;

a third pair of substrate contact pads disposed on the top surface of the finger assembly adjacent to the first pair of consumable contact pads and between the first pair and second pair of consumable pads; and

a fourth pair of substrate contact pads disposed on the top surface of the finger assembly adjacent to the second pair of consumable contact pads and between the first pair and second pair of consumable pads,

wherein the finger assembly is configured for transporting both a consumable part using the first and second pairs of consumable contact pads and a substrate using the third and fourth pairs of substrate contact pads.

15. The cluster tool assembly of claim 14, wherein the first pair and the second pair of consumable contact pads are disposed outside of a diameter of the substrate, and wherein the third pair and the fourth pair of substrate contact pads are disposed inside of a diameter of the substrate.

16. The cluster tool assembly of claim 8, further includes a dynamic aligner coupled to the atmospheric transfer module to provide alignment input to a computer communicatively connected to the dynamic aligner and the atmospheric transfer module, wherein the computer is used to transmit a signal with the alignment input to the first robot.

17. The cluster tool assembly of claim 8, further includes one or more wafer loaders that are disposed at the first side of the atmospheric transfer module, each of the one or more wafer loaders includes a wafer buffer that includes plurality of compartments to store processed or un-processed substrates.

18. The cluster tool assembly of claim 8, further includes a controller interfacing with each one of the atmospheric transfer module, the vacuum transfer module, the loadlock chamber, the process module, and the replacement station, the controller including transfer logic and a vacuum state control, the transfer logic used to coordinate access to the replacement station, the atmospheric transfer module, the loadlock chamber, the vacuum transfer module, and the process module, and the vacuum state control used to maintain the process module and the vacuum transfer module in a vacuum state.

19. The cluster tool assembly of claim 8, wherein the process module includes a lift mechanism to move the consumable part within the process module from an installed position to a raised position, so as to provide access to the consumable part during replacement, and to move the consumable part from the raised position to the installed position.

20. The cluster tool assembly of claim 8, wherein the first robot, the second robot, the vacuum transfer module, the process module and the loadlock chamber are interfaced with a controller to coordinate movement of the consumable part between the replacement station and the loadlock chamber, and between the loadlock chamber and the process module.

21. The cluster tool assembly of claim 8, wherein the loadlock chamber further includes a vacuum control coupled to a pump, wherein the vacuum control interfaces with a controller to coordinate action of the pump, the pump configured to maintain the loadlock chamber in a vacuum state during operation.

22. The cluster tool assembly of claim 8, wherein the replacement station includes a structure resembling a front opening unified pod structure of a wafer loader used for transferring a substrate, an opening in the replacement station interfacing with an opening of a load port defined on the first side of the atmospheric transfer module.

23. The cluster tool assembly of claim 22, wherein the interfacing is performed automatically using an automated host material handling system available in a host fabrication facility where the cluster tool assembly is located, the automated host material handling system including a tracking software to guide an Overhead Hoist Transfer (OHT) or an Automatic Guided Vehicle (AGV) of the automated host material handling system to an appropriate replacement station or a wafer loader stored in the host fabrication facility.

24. A cluster tool assembly used for processing a substrate, the cluster tool assembly having an atmospheric transfer module, a vacuum transfer module, a loadlock chamber and a process module, the cluster tool assembly comprising:

a replacement station coupled to a first side of the atmospheric transfer module, the replacement station having a part buffer with a plurality of compartments to store new or used consumable parts;

the loadlock chamber coupled to a second side of the atmospheric transfer module and a first side of the vacuum transfer module, the loadlock chamber providing an interface between the atmospheric transfer module and the vacuum transfer module, the loadlock chamber comprising;

a support mechanism having a plurality of finger assemblies, each one of the plurality of finger assemblies includes a top support finger and a bottom support finger, the top and the bottom support fingers having a first end and a second end, a top surface of the bottom support finger includes an indent defined proximal to the second end and between the first end and the second end;

a first spacer block disposed between the top support finger and the bottom support finger at the first end,

a second spacer block disposed below the bottom support finger at the first end;

a substrate contact pad is disposed on the top surface of the top and the bottom support fingers at the second end proximal to a tip of the top and bottom support fingers; and

a consumable contact pad is disposed in the indent, the consumable contact pad being disposed between the substrate contact pad disposed in the bottom support finger and the first end of the bottom support finger,

wherein the plurality of finger assemblies are configured to transport both a consumable part using the consumable contact pad and a substrate using the substrate contact pad.