DISPLAY WITH COLOR CONVERSION

• US 20170122502A1
• Filed: 11/02/2015
• Published: 05/04/2017
• Est. Priority Date: 06/18/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Bower, Christopher, Meitl, Matthew
• Granted Patent: US 10,431,719 B2
• Time in Patent Office: Days
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 26/04 by periodically varying the intensity of light, e.g. using choppers shutters, diaphragms for cameras G03B9/00; devices for eliminating or reducing the effect of flicker in projection systems G03B21/40
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2310/0264 Details of driving circuits
• CPC Class Codes: G09G 3/22 using controlled light sources
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/385 : the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0329 : Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 : Display
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 5/0017 : with operator interface units

Abstract

A color-conversion structure includes an article comprising a color-conversion material disposed within a color-conversion layer. At least a portion of a tether is within or extends from the article. The color-conversion structure can be disposed over a sacrificial portion of a substrate to form a micro-transfer printable device and micro-transfer printed to a display substrate. The color-conversion structure can include an light-emitting diode or laser diode that is over or under the article. Alternatively, the article is located on a side of a display substrate opposite an inorganic light-emitting diode. A display includes an array of color-conversion structures disposed on a display substrate.

Claims

1. A color-conversion structure, comprising:

an article comprising a color-conversion material disposed within a color-conversion layer;

at least a portion of a tether connected to the article, wherein the at least a portion of a tether extends from the article.

4. The structure of claim 1, wherein the article comprises:

a first layer;

the color-conversion material disposed on the first layer; and

a second layer disposed on the color-conversion material, the first and second layers encapsulating the color-conversion materials.

8. The structure of claim 1, comprising a micro-light-emitting diode (micro-LED) having a light-emitting side disposed to emit light toward the color-conversion material.

9. The structure of claim 8, wherein the micro-LED is a solid-state laser.

10. The structure of claim 1, comprising:

a source substrate having one or more sacrificial portions;

the color-conversion layer disposed on or over each of the sacrificial portions; and

the tether extending from a periphery of the sacrificial portion.

12. The structure of claim 10, comprising a micro-light-emitting diode (micro-LED) having a light-emitting side disposed to emit light toward the color-conversion material and wherein the color-conversion material is located between the micro-LED and the sacrificial layer.

13. The structure of claim 10, comprising a micro-light-emitting diode (micro-LED) having a light-emitting side disposed to emit light toward the color-conversion material and wherein the micro-LED is located between the color-conversion material and the sacrificial layer.

15. The structure of claim 1, comprising a micro-light-emitting diode (micro-LED) having a light-emitting side disposed to emit light toward the color-conversion material and, optionally wherein the micro-LED is a micro-transfer printable or micro-transfer printed micro-LED, forming a pixel structure.

16. The structure of claim 15, comprising a transparent destination substrate and wherein the pixel structure is disposed on the transparent destination substrate.

17. The structure of claim 15, comprising a destination substrate and wherein the pixel structure is disposed on the destination substrate and the color-conversion material is located between the micro-LED and the destination substrate or the pixel structure is disposed on the destination substrate and the destination substrate is located between the micro-LED and the color-conversion material.

18. The structure of claim 15, comprising a destination substrate and wherein the pixel structure is disposed on the destination substrate and the micro-LED is located between the color-conversion material and the destination substrate.

2-3. -3. (canceled)

5-7. -7. (canceled)

11. (canceled)

14. (canceled)

19-32. -32. (canceled)

33. A color-conversion structure, comprising:

a source substrate having one or more sacrificial portions;

one or more pixel or sub-pixel structures, each pixel or sub-pixel structure comprising;

an article comprising a color-conversion material disposed within a color-conversion layer on or over each of the sacrificial portions, and

a micro-light-emitting diode (micro-LED) having a light-emitting side disposed to emit light toward the color-conversion material, the article disposed on the micro-LED on a side of the micro-LED opposite the sacrificial portion; and

one or more tethers, each tether extending from the inorganic light-emitting diode.

40. The structure of claim 33, wherein the micro-LED is an organic or inorganic solid-state laser or an organic or inorganic semiconductor laser.

34-39. -39. (canceled)

41-51. -51. (canceled)

52. A display, comprising:

a display substrate;

an array of color-conversion structures disposed on the display substrate, each color-conversion structure comprising a micro-light-emitting diode (micro-LED) disposed to emit light toward an article comprising a color-conversion material on the display substrate; and

at least a portion of a tether extending from the article.

57. The display of claim 52, wherein the micro-LEDs are lasers.

63. The display of claim 52, wherein each micro-LED has an anode and a cathode disposed on a same side of the respective micro-LED and, optionally, the anode and cathode of a respective light emitter are horizontally separated by a horizontal distance, wherein the horizontal distance is from 100 nm to 500 nm, 500 nm to 1 micron, 1 micron to 20 microns, 20 microns to 50 microns, or 50 microns to 100 microns.

53-56. -56. (canceled)

58-62. -62. (canceled)

64. A display, comprising:

a display substrate;

an array of color-conversion structures disposed on the display substrate, each color-conversion structure including a micro-light-emitting diode (micro-LED) disposed to emit light toward an article comprising a color-conversion material on the display substrate, wherein the display substrate is between the article and the micro-LED.

65. The display of claim 64, wherein the micro-LEDs are lasers.

66. (canceled)

67. A method of making a display, comprising:

providing a source wafer and a source substrate;

forming a plurality of micro-LEDs on the source wafer and a corresponding plurality of color-conversion structures on the source substrate;

micro-transfer printing the micro-LEDs onto the color-conversion structures to form a plurality of respective pixel structures or micro-transfer printing the color-conversion structures onto the micro-LEDs to form a plurality of respective pixel structures; and

micro-transfer printing the plurality of pixel structures onto a destination substrate to form the display.

68-69. -69. (canceled)

70. A method of making a display, comprising:

providing a source wafer and a source substrate;

forming a plurality of micro-LEDs on the source wafer and a corresponding plurality of color-conversion structures on the source substrate;

micro-transfer printing the micro-LEDs onto a destination substrate and micro-transfer printing the color-conversion structures onto respective micro-LEDs or micro-transfer printing the color-conversion structure onto a destination substrate and micro-transfer printing micro-LEDs onto respective color-conversion structures to form a plurality of respective pixel structures forming the display.

71-72. -72. (canceled)

73. A method of making a display, comprising:

providing a source wafer and a source substrate;

forming a plurality of micro-LEDs on the source wafer and a corresponding plurality of color-conversion structures on the source substrate;

micro-transfer printing the micro-LEDs onto a first side of a destination substrate and micro-transfer printing color-conversion structures onto a second side of the destination substrate opposite the first side and in correspondence with the micro-LED to form an array of pixels in the display.

74-77. -77. (canceled)