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SEMICONDUCTOR PACKAGE WITH COATED BONDING WIRES AND FABRICATION METHOD THEREOF

  • US 20170125327A1
  • Filed: 06/08/2016
  • Published: 05/04/2017
  • Est. Priority Date: 11/02/2015
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a carrier substrate having a top surface;

    a semiconductor die mounted on the top surface;

    a plurality of bonding wires connecting the semiconductor die to the carrier substrate;

    an insulating material coated on the bonding wires; and

    a molding compound covering the top surface and encapsulating the semiconductor die, the plurality of bonding wires, and the insulating material.

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