LIGHT EMITTING DEVICE
First Claim
1. A light emitting device, comprising:
- a light emitting unit, comprising;
a substrate,an epitaxial structure layer, disposed on the substrate; and
a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer opposite to the substrate;
a light transmissive layer, disposed on the light emitting unit and located at one side of the substrate opposite to the epitaxial structure layer, the first electrode and the second electrode; and
an encapsulant, located between the light emitting unit and the light transmissive layer, and encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode extend outwardly to cover at least a part of an upper surface of the encapsulant respectively;
wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material.
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Accused Products
Abstract
A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.
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Citations
20 Claims
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1. A light emitting device, comprising:
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a light emitting unit, comprising; a substrate, an epitaxial structure layer, disposed on the substrate; and a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer opposite to the substrate; a light transmissive layer, disposed on the light emitting unit and located at one side of the substrate opposite to the epitaxial structure layer, the first electrode and the second electrode; and an encapsulant, located between the light emitting unit and the light transmissive layer, and encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode extend outwardly to cover at least a part of an upper surface of the encapsulant respectively; wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A light emitting device, comprising:
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a light emitting unit, comprising; a substrate, an epitaxial structure layer, disposed on the substrate; and a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer; and an encapsulant, encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode respectively extend upward from the epitaxial structure layer; wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A light emitting device, comprising:
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a light emitting unit, comprising; a substrate; an epitaxial structure layer, disposed on the substrate; and a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer; a light transmissive layer, wherein the light emitting unit is disposed on the light transmissive layer and at least exposes the first electrode and the second electrode; and an encapsulant, encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode respectively extend upward from the epitaxial structure layer; wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material. - View Dependent Claims (17, 18, 19, 20)
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Specification