LIGHT EMITTING DEVICE

• US 20170125645A1
• Filed: 01/13/2017
• Published: 05/04/2017
• Est. Priority Date: 05/07/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Ting, Shao-Ying, Huang, Kuan-Chieh, Huang, Jing-En, Lin, Yu-Feng, Huang, Yi-Ru
• Granted Patent: US 10,050,183 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.

Claims

1. A light emitting device, comprising:

a light emitting unit, comprising;

a substrate,

an epitaxial structure layer, disposed on the substrate; and

a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer opposite to the substrate;

a light transmissive layer, disposed on the light emitting unit and located at one side of the substrate opposite to the epitaxial structure layer, the first electrode and the second electrode; and

an encapsulant, located between the light emitting unit and the light transmissive layer, and encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode extend outwardly to cover at least a part of an upper surface of the encapsulant respectively;

wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material.

2. The light emitting device as claimed in claim 1, further comprising:

one or more flat surfaces each comprising the light transmissive layer and the encapsulant.

3. The light emitting device as claimed in claim 1, wherein the first electrode comprises a first electrode portion connected to the epitaxial structure layer and a first electrode extending portion connected to the first electrode portion, and the second electrode comprises a second electrode portion connected to the epitaxial structure layer and a second electrode extending portion connected to the second electrode portion, and the first electrode extending portion and the second electrode extending portion respectively extend outward to at least a part of the upper surface of the encapsulant.

4. The light emitting device as claimed in claim 3, wherein the first electrode extending portion and the second electrode extending portion are aligned with or contracted inward relative to an edge of the upper surface of the encapsulant.

5. The light emitting device as claimed in claim 3, wherein the first electrode extending portion comprises a plurality of first sub-electrodes separated from each other, the second electrode extending portion comprises a plurality of second sub-electrodes separated from each other, and the two cured solder pastes are respectively filled in an interval between two adjacent first sub-electrodes and an interval between two adjacent second sub-electrodes.

6. The light emitting device as claimed in claim 5, wherein the first sub-electrodes of the first electrode extending portion are grouped into two first sub-electrode groups, where each of the first sub-electrode groups respectively includes a part of the first sub-electrodes, and the second sub-electrodes of the second electrode extending portion are grouped into two second sub-electrode groups, where each of the second sub-electrode groups respectively includes a part of the second sub-electrodes.

7. The light emitting device as claimed in claim 6, wherein the two first sub-electrode groups are respectively disposed at two adjacent corners on the upper surface of the encapsulant, and the two second sub-electrode groups are respectively disposed at another two adjacent corners on the upper surface of the encapsulant.

8. The light emitting device as claimed in claim 1, further comprising:

a wavelength conversion material mixed in the encapsulant.

9. A light emitting device, comprising:

a light emitting unit, comprising;

a substrate,

an epitaxial structure layer, disposed on the substrate; and

a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer; and

an encapsulant, encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode respectively extend upward from the epitaxial structure layer;

wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material.

10. The light emitting device as claimed in claim 9 wherein the encapsulant has one or more flat surfaces.

11. The light emitting device as claimed in claim 9, wherein the first electrode comprises a first electrode portion and a first electrode extending portion, and the second electrode comprises a second electrode portion and a second electrode extending portion, wherein the first electrode extending portion and the second electrode extending portion are coplanar with an upper surface of the encapsulant, and the first electrode extending portion and the second electrode extending portion respectively protrude out from the upper surface of the encapsulant.

12. The light emitting device as claimed in claim 11, wherein the first electrode extending portion comprises a plurality of first sub-electrodes separated from each other, the second electrode extending portion comprises a plurality of second sub-electrodes separated from each other, and the two cured solder pastes are respectively filled in an interval between two adjacent first sub-electrodes and an interval between two adjacent second sub-electrodes.

13. The light emitting device as claimed in claim 12, wherein the first sub-electrodes of the first electrode extending portion are grouped into two first sub-electrode groups, where each of the first sub-electrode groups respectively includes a part of the first sub-electrodes, and the second sub-electrodes of the second electrode extending portion are grouped into two second sub-electrode groups, where each of the second sub-electrode groups respectively includes a part of the second sub-electrodes.

14. The light emitting device as claimed in claim 13, wherein the two first sub-electrode groups are respectively disposed at two adjacent corners on the upper surface of the encapsulant, and the two second sub-electrode groups are respectively disposed at another two adjacent corners on the upper surface of the encapsulant.

15. The light emitting device as claimed in claim 9, further comprising:

a wavelength conversion material mixed in the encapsulant.

16. A light emitting device, comprising:

a light emitting unit, comprising;

a substrate;

an epitaxial structure layer, disposed on the substrate; and

a first electrode and a second electrode, respectively disposed on a same side of the epitaxial structure layer;

a light transmissive layer, wherein the light emitting unit is disposed on the light transmissive layer and at least exposes the first electrode and the second electrode; and

an encapsulant, encapsulating the light emitting unit and at least exposing a part of the first electrode and a part of the second electrode, wherein the first electrode and the second electrode respectively extend upward from the epitaxial structure layer;

wherein the first electrode and the second electrode are configured to be bonded to a first and a second electrode pads of an external circuit through a bonding material.

17. The light emitting device as claimed in claim 16, further comprising:

one or more flat surfaces each comprising the light transmissive layer and the encapsulant.

18. The light emitting device as claimed in claim 17, wherein the first electrode comprises a first electrode portion and a first electrode extending portion, and the second electrode comprises a second electrode portion and a second electrode extending portion, wherein the first electrode portion and the second electrode portion are coplanar with an upper surface of the encapsulant, and the first electrode extending portion and the second electrode extending portion respectively protrude out from the upper surface of the encapsulant.

19. The light emitting device as claimed in claim 18, wherein the first electrode extending portion and the second electrode extending portion are aligned with or contracted inward relative to an edge of the upper surface of the encapsulant.

20. The light emitting device as claimed in claim 18, wherein the first electrode extending portion comprises a plurality of first sub-electrodes separated from each other, the second electrode extending portion comprises a plurality of second sub-electrodes separated from each other, and the two cured solder pastes are respectively filled in an interval between two adjacent first sub-electrodes and an interval between two adjacent second sub-electrodes.