PRESSURE SENSOR

• US 20170129774A1
• Filed: 01/24/2017
• Published: 05/11/2017
• Est. Priority Date: 06/25/2014
• Status: Active Grant

• Current Assignee: Miramems Sensing Technology Co., Ltd
• Original Assignee: Miramems Sensing Technology Co., Ltd
• Inventors: CHIEN, Yu-Hao, TSENG, Li-Tien
• Granted Patent: US 9,809,447 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2203/033 Trenches
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/094 Feed-through, via
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2201/112 Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
• CPC Class Codes: B81C 2203/0172 Seals
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.

Claims

1. A pressure sensor, comprising:

a first substrate comprising a metal layer, wherein the metal layer is partially exposed on a surface of the first substrate to form a first circuit, a second circuit and a conductive contact; and

a second substrate comprising a first surface and a second surface, wherein the second substrate faces the surface of the first substrate with the first surface and is electrically connected to the conductive contact, wherein the second substrate comprises;

a MEMS element corresponding to the first circuit and defining an airtight chamber with the first substrate and the second substrate;

a reference element corresponding to the second circuit and kept a fixed distance from the second circuit; and

a first airtight ring configured for surrounding the chamber, wherein the first airtight ring penetrates the second surface of the second substrate, extends to an interface between the first substrate and the second substrate, and protrudes from and breaks out the interface.

2. The pressure sensor according to claim 1, wherein the first airtight ring connects to the metal layer of the first substrate.

3. The pressure sensor according to claim 1, wherein the first airtight ring comprises a conductive material.

4. The pressure sensor according to claim 1, further comprising:

a second airtight ring corresponding to the first airtight ring, configured on the first substrate and connecting the metal layer and another lower metal layer.

5. The pressure sensor according to claim 1, further comprising:

an anti-sticking layer configured on the inner surface of the chamber, wherein the chamber comprises at least one micro channel extending to the first airtight ring, and the micro channel is configured on the first substrate or the second substrate.

6. The pressure sensor according to claim 5, wherein the micro channel comprises a bent portion bending to horizontal or vertical direction.

7. The pressure sensor according to claim 5, wherein the micro channel comprises a dam for reducing the inner diameter of the micro channel.

8. The pressure sensor according to claim 1, wherein the MEMS element comprises a notch configured on side of the first surface or side of the second surface.

9. The pressure sensor according to claim 1, wherein an anti-moving bump is configured on the surface of the first substrate corresponding to the MEMS element.

10. The pressure sensor according to claim 1, wherein the second substrate comprises a conductive via penetrating the first surface and the second surface of the second substrate, wherein the conductive via is electrically connected to the conductive contact and the second substrate through an ohmic contact, and the ohmic contact region is made of at least one of silicon, aluminum-copper alloy, titanium nitride and tungsten.

11. The pressure sensor according to claim 10, wherein the conductive via is integrated into the first airtight ring.

12. The pressure sensor according to claim 1, wherein the first substrate comprises a complementary metal oxide semiconductor substrate.

13. The pressure sensor according to claim 1, further comprising:

a third substrate having a notch region and a plurality of bracket structure, the third substrate is configured above the second substrate and is connected to the first substrate through the bracket structure to place the second substrate in the notch region.

14. The pressure sensor according to claim 13, wherein the third substrate comprises a channel configured on a terminal of the bracket structure.