BONDING METHOD WITH PERIPHERAL TRENCH

• US 20170131415A1
• Filed: 07/25/2014
• Published: 05/11/2017
• Est. Priority Date: 07/25/2014
• Status: Active Grant

• Current Assignee: Teledyne Digital Imaging, Inc. (Teledyne Technologies Incorporated)
• Original Assignee: Teledyne Dalsa Incorporated (Teledyne Technologies Incorporated)
• Inventors: VAN ARENDONK, Anton Petrus Maria, GOOSSENS, Peter
• Granted Patent: US 9,864,071 B2
• Time in Patent Office: Days
• CPC Class Codes: F16B 11/006 by gluing gluing of plastics material B29C65/48
• CPC Class Codes: G01T 1/2006 using a combination of a scintillator and photodetector which measures the means radiation intensity
• CPC Class Codes: G01T 1/243 Modular detectors, e.g. arrays formed from self contained units constructional or manufacturing details H01L25/00
• CPC Class Codes: G01T 7/00 Details of radiation-measuring instruments
• CPC Class Codes: H01L 27/14618 Containers

Abstract

A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.

Claims

1. A method of making an integrated device having upper and lower planar components forming part of a stack and bonded together by an adhesive layer of well-defined thickness, comprising:

providing a trench within a peripheral recess formed within a marginal portion of a support frame for said stack;

applying an excess amount of adhesive to one of said planar components;

bringing said upper and lower planar components into proximity such that said adhesive layer of well-defined thickness is formed between said upper and lower planar components; and

collecting surplus adhesive in said trench.

2. The method as claimed in claim 1, wherein the lower component is a silicon substrate.

3. The method as claimed in claim 2, wherein the peripheral trench is linear.

4. The method as claimed in claim 2, wherein the peripheral trench is formed on opposite sides of the support frame.

5. The method as claimed in claim 2, wherein the support frame is made of aluminum.

6. The method as claimed in claim 5, wherein the peripheral trench is milled into the support frame.

7. The method as claimed in claim 2, wherein the surplus adhesive remains in situ in the peripheral trench during a subsequent curing step.

8. The method as claimed in claim 1, wherein the trench is U-shaped.

9. The method as claimed in claim 1, wherein the device is an X-ray detector.

20. The method as claimed in claim 6, wherein the trench is U-shaped.

21. The method as claimed in claim 6, wherein the device is an X-ray detector.

10. An integrated device comprising:

a planar substrate forming part of a stack bonded onto a support frame,

an upper layer bonded onto said planar substrate by an adhesive layer of well-defined thickness, and

wherein said support frame has peripheral recess formed in a marginal portion thereof below said planar substrate and a trench within said peripheral contains surplus adhesive.

11. The integrated device as claimed in claim 10, wherein the upper layer is an interface layer.

12. The device as claimed in claim 10, wherein the peripheral trench is linear.

13. The device as claimed in claim 11, wherein the peripheral trench is located on opposite sides of the support frame.

14. The device as claimed in claim 10, wherein the support frame is made of aluminum.

15. The device as claimed in claim 12, wherein the trench is milled into the support frame.

16. The device as claimed in claim 10, wherein the trench is U-shaped.

17. The device as claimed in claim 10, wherein the device is an X-ray detector.

18. A device as claimed in claim 11, wherein the trench is U-shaped.

19. A device as claimed in claim 13, wherein the trench is U-shaped.