PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC SURFACES WITH PRESSURE MODULATED REVERSIBLE ADHESION

• US 20170133250A1
• Filed: 06/28/2016
• Published: 05/11/2017
• Est. Priority Date: 09/20/2011
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: Board of Trustees of The University of Illinois, Semprius, Inc.
• Inventors: Menard, Etienne, Kim, Seok, Carlson, Andrew, Rogers, John A.
• Granted Patent: US 10,717,267 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2313/00 Elements other than metals
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: B32B 37/16 with all layers existing as coherent layers before laminating
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: B32B 9/005 comprising one layer of ceramic material, e.g. porcelain, ceramic tile layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: B41F 16/00 Transfer printing apparatus
• CPC Class Codes: B41F 16/006 Arrangements for moving, supporting or positioning the printing foil or band
• CPC Class Codes: B81C 1/00373 Selective deposition, e.g. printing or microcontact printing
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence

Abstract

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

Claims

1. An elastomeric stamp, comprising:

a deformable elastomeric layer including a post protruding therefrom, the post having an elastomeric surface configured for contact with a transferable component, wherein the elastomeric surface includes a plurality of three-dimensional relief features protruding therefrom, wherein at least a portion of the relief features and a region of the post between the relief features are mechanically deformed when the post is pressed against a transferable component at a first pressure so that the post contacts the transferable component over a first contact area, and wherein the post contacts the transferable component over a second contact area smaller than the first contact area when the post is pressed against the transferable component at a second pressure less than the first pressure.

2. The stamp of claim 1, wherein ones of the plurality of relief features are spaced apart from one another on the surface at a distance sufficient such that a region of the surface therebetween is deformable to contact the transferable component responsive to application of a predetermined force to the stamp.

3. The stamp of claim 2, wherein the predetermined force is sufficient to compress the plurality of relief features and collapse the region of the surface therebetween to contact the transferable component over a first contact area that is substantially similar to a cross-sectional area of the post taken along a plane parallel to the surface thereof.

4. The stamp of claim 2, wherein the predetermined force is about 0.39 mN or more.

5. The stamp of claim 2, wherein ones of the plurality of relief features are positioned around a periphery of the surface of the post.

6. The stamp of claim 5, wherein each of the relief features is positioned at a respective corner of the post

7. The stamp of claim 5, wherein the plurality of relief features comprise first relief features, and wherein the surface of the post further includes a second three-dimensional relief feature that protrudes from the region thereof between the first relief features and is configured to support the transferable component.

8. The stamp of claim 7, wherein the second relief feature is larger than the first relief features in at least one dimension.

9. The stamp of claim 2, wherein a height of each of the plurality of relief features is based on the distance between the ones of the plurality of relief features and an elasticity of the deformable elastomeric layer.

10. The stamp of claim 9, wherein the elastomeric layer including the post and the plurality of relief features comprises polydimethylsiloxane (PDMS).

11. The stamp of claim 10, wherein the height of each of the plurality of relief features is between about 8.5 micrometers and about 13 micrometers.

12. The stamp of claim 1, wherein respective tips of the relief features comprise pyramidal, conical, and/or spherical geometries.