PACKAGED WAVELENGTH CONVERTED LIGHT EMITTING DEVICE

• US 20170133560A1
• Filed: 06/23/2015
• Published: 05/11/2017
• Est. Priority Date: 06/25/2014
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Basin, Grigoriy, Liu, Jing, Juan, Chung-Chih, Balakrishnan, R. B. Syivaram, De Smet, Thierry Maurice Francois
• Granted Patent: US 10,998,473 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

Embodiments of the invention include a plurality of light emitting devices (1), one of the light emitting devices in the plurality being configured to emit light having a first peak wavelength. A wavelength converting layer (30) is disposed in a path of light emitted by the plurality of light emitting devices. The wavelength converting layer (30) absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The light emitting devices (1) are mechanically connected to each other only through the wavelength converting layer (30). In other embodiments a light converting layer is placed over the light emitting devices and an adhesive or optical element layer is placed at the side surfaces and over the light converting layer, the light emitting devices are mechanically connected to each other only through the wavelength converting layer.

Claims

1. A structure comprising:

a plurality of light emitting devices, one of the light emitting devices in the plurality being configured to emit light having a first peak wavelength; and

a wavelength converting layer disposed in a path of light emitted by the plurality of light emitting devices, the wavelength converting layer for absorbing light emitted by the light emitting device and emitting light having a second peak wavelength;

wherein the plurality of light emitting devices are mechanically connected to each other only through the wavelength converting layer.

2. The structure of claim 1 wherein the wavelength converting layer comprises a mixture of:

a wavelength converting material;

a transparent material; and

an adhesive material, wherein the adhesive material comprises no more than 15% of the weight of the wavelength converting layer.

3. The structure of claim 1 wherein each of the plurality of light emitting devices has a top surface, a bottom surface opposite the top surface, and at least one side surface connecting the top surface to the bottom surface, wherein the wavelength converting layer covers the top surface and every side surface of each light emitting device.

4. The structure of claim 1 wherein the wavelength converting layer is molded over the light emitting device.

5. A structure comprising:

a light emitting device for emitting light having a first peak wavelength;

a wavelength converting layer disposed over the light emitting device; and

an optical element layer disposed over the wavelength converting layer, wherein the optical element layer covers a top surface and every side surface of the light emitting device.

6. The structure of claim 5 wherein the wavelength converting layer has a thickness less than 100 μ

m.

7. The structure of claim 5 wherein the wavelength converting layer is laminated over the light emitting device.

8. The structure of claim 5 wherein the optical element layer is molded over the light emitting device.

9. The structure of claim 5 wherein the light emitting device is a first light emitting device, the structure further comprising a second light emitting device, wherein the first and second light emitting devices are mechanically connected only through the optical element layer.

10. The structure of claim 5 wherein the optical element layer and the light emitting device together are shaped as a parallelepiped.

11. A structure comprising:

a plurality of light emitting devices, one of the light emitting devices in the plurality being configured to emit light having a first peak wavelength, each of the light emitting devices comprising a top surface, a bottom surface opposite the top surface, and at least one side surface connecting the top and bottom surfaces; and

an adhesive material disposed over the top surface and the at least one side surface of each of the light emitting devices;

wherein the plurality of light emitting devices are mechanically connected to each other only through the adhesive material.

12. The structure of claim 11 wherein the adhesive material is mixed with a wavelength converting material, the wavelength converting material for absorbing light of the first peak wavelength and emitting light having a second peak wavelength.

13. The structure of claim 11 wherein the adhesive material is mixed with a transparent material.

14. The structure of claim 11 further comprising a wavelength converting layer disposed between the plurality of light emitting devices and the adhesive material.

15. The structure of claim 11 wherein:

the plurality of light emitting devices are connected via the adhesive material disposed between the side surfaces of the light emitting devices and over the top surfaces of the light emitting devices; and

the bottom surfaces of the plurality of light emitting devices are unconnected.