ADVANCED OPTICAL SENSOR AND METHOD FOR PLASMA CHAMBER

• US 20170140905A1
• Filed: 11/15/2016
• Published: 05/18/2017
• Est. Priority Date: 11/16/2015
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Tian, Xinkang, Ferns, Jason, Ng, Joel, Hyatt, Badru D., Yan, Zheng, Mihaylov, Mihail, Meng, Ching-Ling, Vuong, Vi
• Granted Patent: US 10,692,705 B2
• Time in Patent Office: Days
• CPC Class Codes: G01J 1/42 using electric radiation detectors optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10
• CPC Class Codes: G01J 1/46 using a capacitor
• CPC Class Codes: G01J 2001/4247 for testing lamps or other light sources
• CPC Class Codes: G01J 3/28 Investigating the spectrum using colour filters G01J3/51
• CPC Class Codes: G01J 3/2803 using photoelectric array detector
• CPC Class Codes: G01J 3/443 Emission spectrometry
• CPC Class Codes: H01J 37/32917 Plasma diagnostics
• CPC Class Codes: H01J 37/32944 Arc detection
• CPC Class Codes: H01J 37/32972 Spectral analysis

Abstract

An advanced optical sensor and method for detection of optical events in a plasma processing system. The method includes detecting at least one light emission signal in a plasma processing chamber. The at least one detected light emission signal including light emissions from an optical event. The method further includes processing the at least one light emission signal and detecting a signature of the optical event from the processed light emission signal.

Claims

1. A method for detection of optical events in a plasma processing system, the method comprising:

detecting at least one light emission signal in a plasma processing chamber, the at least one detected light emission signal including light emissions from an optical event;

processing the at least one light emission signal; and

detecting a signature of the optical event from the processed light emission signal.

2. The method of claim 1, further comprising:

igniting a plasma in the plasma processing chamber, wherein the at least one light emission signal further includes light emissions from the plasma; and

processing the at least one light emission signal to suppress a plasma light emission from the emissions from an optical event.

3. The method of claim 2, wherein the optical event is an arcing event.

4. The method of claim 3, wherein the signature of the arcing event includes an optical signal having a power at least three orders of magnitude lower than the power of the optical signal of the plasma light emission.

5. The method of claim 4, further comprising:

recording the arcing event for fault detection or notifying the plasma processing system operator, or both.

6. The method of claim 1, wherein the detection of the at least one light emission signal is performed with a time resolution of 10 μ

s, or lower.

7. The method of claim 1, wherein the detection of the at least one light emission signal is performed with a time resolution of 1 μ

s, or lower.

8. The method of claim 1, wherein the detection of the at least one light emission signal includes detecting a plurality of light emission signals using one or more optical detectors.

9. The method of claim 8, wherein at least one optical detector includes a photodiode.

10. The method of claim 8, wherein at least one optical detector includes a charged-coupled device (CCD).

11. The method of claim 1, wherein the one or more optical detectors are configured to monitor more than about 50% of the plasma processing chamber volume, for optical events.

12. The method of claim 1, wherein the one or more optical detectors are configured to simultaneously monitor a substrate, a focus ring, and a capacitive-coupled RF electrode disposed within the plasma processing chamber.

13. The method of claim 1, wherein the at least one light emission signal is collected by a wide angle lens.

14. The method of claim 2, wherein the processing the at least one light emission signal is performed in a dedicated arcing event controller.

15. The method of claim 1, wherein the processing the at least one light emission signal is performed in a controller that also detects and processes a plasma optical emission spectroscopy (OES) signal.

16. The method of claim 2, wherein the detected light emission includes light emission from an arcing event occurring when the plasma is off during the removal of the chucking force from the substrate.

17. The method of claim 1, wherein the detection of the at least one light emission signal is performed simultaneously with detection of at least one of acoustic emissions from the plasma processing chamber, RF signal in the plasma processing chamber, or plasma optical emission spectra (OES).

18. The method of claim 1, wherein said optical event is an extinguishing event.

19. An apparatus for detection of optical events in a plasma processing system, comprising:

a window disposed on a plasma processing chamber of the plasma processing system, for providing optical access to the plasma processing chamber;

at least one optical detector for detecting light emission signal from an optical event in the plasma processing chamber via a light collector; and

a controller configured to

process the light emission signal based on an operation status of the plasma, and

detect a signature of the optical event from the processed light emission signal.

20. A system for plasma processing, comprising:

a plasma processing chamber;

at least one optical detector for detecting light emission signal from an optical event in the plasma processing chamber via a light collector; and

a controller configured to

process the light emission signal based on an operation status of the plasma, and

detect a signature of the optical event from the processed light emission signal.