SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
First Claim
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1. A semiconductor device comprising:
- a conductive substrate electrically coupled to a first lead, wherein the conductive substrate comprises a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and
a semiconductor die comprising a contact pad electrically coupled to the conductive substrate, wherein the contact pad is attached to both the first planar surface of the first elevated region and the second planar surface of the second elevated region, wherein the first planar surface comprises a curved edge, and wherein the second planar surface has a polygonal shape.
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Abstract
In one embodiment, methods for making semiconductor devices are disclosed.
2 Citations
20 Claims
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1. A semiconductor device comprising:
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a conductive substrate electrically coupled to a first lead, wherein the conductive substrate comprises a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and a semiconductor die comprising a contact pad electrically coupled to the conductive substrate, wherein the contact pad is attached to both the first planar surface of the first elevated region and the second planar surface of the second elevated region, wherein the first planar surface comprises a curved edge, and wherein the second planar surface has a polygonal shape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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a conductive substrate electrically coupled to a first lead, wherein the conductive substrate comprises a first elevated region on a first side of the conductive substrate, and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; a semiconductor die comprising a contact pad electrically coupled to the conductive substrate, wherein the contact pad is attached to the first planar surface of the first elevated region, and wherein the second planar surface of the second elevated region is not attached to the semiconductor die; and a molding at least partially encapsulating the conductive substrate and the semiconductor die, wherein the molding material is disposed on the second planar surface. - View Dependent Claims (12, 13, 14, 15)
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16. A semiconductor device comprising:
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a conductive substrate electrically coupled to a first lead, wherein the conductive substrate comprises a first elevated region on a first side of the conductive substrate and a second elevated region on the first side of the conductive substrate, wherein the first elevated region comprises a first planar surface on the first side of the conductive substrate, and wherein the second elevated region comprises a second planar surface on the first side of the conductive substrate; and a semiconductor die comprising a contact pad electrically coupled to the conductive substrate, wherein the contact pad is attached to both the first planar surface of the first elevated region and the second planar surface of the second elevated region, wherein substantially all of the first planar surface is attached to the contact pad, and wherein only a portion of the second planar surface is attached to the contact pad. - View Dependent Claims (17, 18, 19, 20)
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Specification