MAGNETIC ALIGNMENT FOR FLIP CHIP MICROELECTRONIC DEVICES
First Claim
1. A microelectronic structure, comprising:
- a microelectronic device having an attachment surface, an opposing back surface, and at least one side extending between the attachment surface and the back surface, wherein the microelectronic device attachment surface has at least one magnetic alignment structure and at least one interconnect structure extending therefrom;
a microelectronic substrate having a first surface and having an alignment coil formed therein, and having an unfilled opening extending into the microelectronic substrate from the microelectronic substrate first surface, wherein the unfilled opening is defined by at least one sidewall and a bottom and wherein a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening sidewall; and
wherein the at least one microelectronic device interconnect structure is electrically attached to the microelectronic substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.
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Citations
35 Claims
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1. A microelectronic structure, comprising:
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a microelectronic device having an attachment surface, an opposing back surface, and at least one side extending between the attachment surface and the back surface, wherein the microelectronic device attachment surface has at least one magnetic alignment structure and at least one interconnect structure extending therefrom; a microelectronic substrate having a first surface and having an alignment coil formed therein, and having an unfilled opening extending into the microelectronic substrate from the microelectronic substrate first surface, wherein the unfilled opening is defined by at least one sidewall and a bottom and wherein a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening sidewall; and wherein the at least one microelectronic device interconnect structure is electrically attached to the microelectronic substrate. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 34, 35)
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2. (canceled)
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11-21. -21. (canceled)
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22. An electronic system, comprising:
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a housing; a microelectronic substrate within the housing having a first surface and having an alignment coil formed therein and having an unfilled opening extending into the microelectronic substrate from the microelectronic substrate first surface, wherein the unfilled opening is defined by at least one sidewall and a bottom and wherein a portion of the alignment coil is exposed to the unfilled opening at the least one unfilled opening sidewall; a microelectronic device having an attachment surface, wherein the microelectronic device attachment surface has at least one magnetic alignment structure and at least one interconnect structure extending from the attachment surface of the microelectronic device; and wherein the at least one microelectronic device interconnect structure is electrically attached to the microelectronic substrate first surface. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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23. (canceled)
Specification