FRONT END MODULE

• US 20170141744A1
• Filed: 11/11/2016
• Published: 05/18/2017
• Est. Priority Date: 11/13/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: KIM, Won Gi, KIM, Sun Hong
• Application Number:
  US15/349,110
• Publication Number:
  US 20170141744A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H03F 2200/111 : the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not
• CPC Class Codes: H03F 2200/447 : the amplifier being protected to temperature influence
• CPC Class Codes: H03F 2200/451 : the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 2203/7209 : the gated amplifier being switched from a first band to a second band
• CPC Class Codes: H03F 3/195 : in integrated circuits
• CPC Class Codes: H03F 3/211 : using a combination of several amplifiers H03F3/60 takes precedence
• CPC Class Codes: H03F 3/245 : with semiconductor devices only
• CPC Class Codes: H03F 3/72 : Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
• CPC Class Codes: H04B 1/40 : Circuits
• CPC Class Codes: H05K 1/0206 : by printed thermal vias
• CPC Class Codes: H05K 1/021 : Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 2201/10416 : Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A front end module, includes a circuit board; a plurality of electronic components positioned on the circuit board, the electronic components comprising an amplifier configured to amplify a wireless frequency signal, a duplexer and filter configured to filter the wireless frequency signal amplified by the amplifier, and a switch selectively connecting the duplexer and filter with the amplifier; and a heat sink embedded within the circuit board under the amplifier and connected to the amplifier.

Claims

1. A front end module, comprising:

a circuit board;

electronic components positioned on the circuit board and comprising an amplifier configured to amplify a wireless frequency signal, a duplexer and filter configured to filter the amplified wireless frequency signal, and a switch selectively connecting the duplexer and filter with the amplifier; and

a heat sink embedded within the circuit board, disposed under and connected to the amplifier.

2. The front end module of claim 1, wherein the amplifier comprises an integrated transistor, and the heat sink is disposed under a region in which the integrated transistor of the amplifier is located.

3. The front end module of claim 2, wherein the amplifier comprises integrated transistors, and

the heat sink is disposed under the region in which an integrated transistor outputting the amplified wireless frequency signal among the integrated transistors is located.

4. The front end module of claim 1, wherein the heat sink is connected to a ground terminal formed on a lower surface of the amplifier by a via.

5. The front end module of claim 4, wherein the ground terminal is configured as a ground of an integrated transistor of the amplifier.

6. The front end module of claim 5, wherein the amplifier further comprises ground terminals formed on the lower surface of the amplifier and corresponding to a region in which the integrated transistor is located.

7. The front end module of claim 5, wherein the amplifier further comprises a plurality of ground terminals and the plurality of ground terminals are formed on the lower surface of the amplifier.

8. The front end module of claim 7, wherein a control terminal of the amplifier is formed on a surface other than the lower surface of the amplifier and is connected to a circuit pattern on the circuit board by a wire.

9. The front end module of claim 1, wherein the circuit board further comprises a build-up laminate comprising a core layer and an upper build-up layer and a lower build-up layer, respectively positioned on an upper surface and a lower surface of the core layer.

10. The front end module of claim 9, wherein the heat sink is retained in a cavity penetrating through the core layer.

11. The front end module of claim 9, wherein the heat sink is retained in a cavity penetrating through the build-up laminate.

12. The front end module of claim 11, wherein the heat sink is thicker than the core layer.

13. The front end module of claim 11, further comprising:

upper build-up layers and lower build-up layers, wherein the heat sink is retained in the cavity penetrating through an internal build-up layer adjacent to the core layer.

14. The front end module of claim 13, wherein the heat sink is positioned to form a space between an inner side wall of the cavity and the heat sink, and an external build-up layer disposed outside the internal build-up layer extends to the inner side wall of the cavity to fill the space.

15. The front end module of claim 1, wherein the heat sink is formed of one of copper (Cu), aluminum (Al), and invar.

16. The front end module of claim 1, further comprising:

a plurality of vias configured to thermally and electrically couple the amplifier to the heatsink through a portion of the circuit board.

17. A front end module, comprising:

a circuit board;

an amplifier secured to a surface of the circuit board; and

a heat sink embedded within the circuit board under the amplifier and connected to the amplifier.

18. The front end module of claim 17, further comprising:

a via traversing through the circuit board, the via configured to thermally couple the amplifier with the heat sink.

19. The front end module of claim 17, wherein the heat sink comprises a longitudinally extending metallic block transverse to the circuit board and extending therethrough, the metallic block having a cross-sectional area, co-planar with the circuit board, substantially the same as the amplifier.

20. The front end module of claim 17, wherein the heat sink is thermally and electrically coupled to a ground of the amplifier.