COIL COMPONENT

• US 20170148562A1
• Filed: 10/28/2016
• Published: 05/25/2017
• Est. Priority Date: 11/20/2015
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Sa Yong, KANG, Myung Sam
• Application Number:
  US15/337,603
• Publication Number:
  US 20170148562A1
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 27/292 Surface mounted devices

Abstract

A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.

Claims

1. A coil component, comprising:

a body comprising

a magnetic material,

coil pattern layers encased by the magnetic material,

a core portion surrounded by the coil pattern layers, and

an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and

an external electrode disposed on the body.

2. The coil component of claim 1, wherein the insulating layer comprises a magnetic film.

3. The coil component of claim 2, wherein the magnetic film comprises an insulating resin and a magnetic filler.

4. The coil component of claim 1, wherein the coil pattern layers are connected by a via hole passing through the insulating layer.

5. The coil component of claim 4, wherein the via hole comprises an intermetallic compound (IMC).

6. The coil component of claim 1, wherein the insulating layer comprises insulating layers interposed between the coil pattern layers, and the coil pattern layers and the insulating layers are alternately stacked.

7. The coil component of claim 6, wherein each of the coil pattern layers is formed by a single plating layer.

8. The coil component of claim 7, wherein each of the coil pattern layers comprises a thickness-to-width ratio less than or equal to 1 with respect to a width of the planar spiral-shaped pattern.

9. The coil component of claim 1, wherein the coil pattern layers are formed by plating layers.

10. The coil component of claim 9, wherein each of the coil pattern layers comprises a thickness-to-width ratio greater than 1 with respect to a width of the planar spiral-shaped pattern.

11. The coil component of claim 1, wherein the body further comprises magnetic layers isolated by the insulating layer and contacting the coil pattern layers, respectively.

12. A coil component, comprising:

a body comprising

a magnetic material,

a coil encased by the magnetic material and comprising conductive pattern layers arranged in a stack and surrounding a central region of the body, and

an insulating layer disposed in the central region and between adjacent conductive pattern layers among the conductive pattern layers; and

an electrode disposed on an exterior surface of the magnetic body.

13. The coil component of claim 12, comprising vias connecting the conductive pattern layers to each other.

14. The coil component of claim 12, wherein each of the conductive pattern layers comprises a plating layer without a seed layer.

15. The coil component of claim 12, wherein each of the conductive pattern layers comprises a planar spiral-shaped pattern, and wherein the planar spiral-shaped pattern has a thickness-to-width ratio of 0.5 to 1.5.