METHODS AND APPARATUS FOR COLLOCATING ELECTROMAGNETIC COILS AND ELECTRONIC CIRCUITS
First Claim
1. An apparatus comprising:
- a plurality of electromagnetic coils and a plurality of circuit boards, said circuit boards have planar surface and thickness and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils.
1 Assignment
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Accused Products
Abstract
Methods and apparatus according to the invention include inductive units or apparatus such as magnetic metal detectors comprising multiple electromagnetic coils and circuit boards such as electronic printed circuit boards (PCBs) so that the circuit boards, while containing metallic surfaces and layers, are positioned in such a way as to reduce or eliminate their effect on the metal detector'"'"'s coils. The apparatus comprising: a plurality of electromagnetic coils and a plurality of circuit boards, and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils.
10 Citations
20 Claims
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1. An apparatus comprising:
a plurality of electromagnetic coils and a plurality of circuit boards, said circuit boards have planar surface and thickness and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for collocating electromagnetic coils and circuit boards in a detector, said circuit boards have planar surface and thickness, the method comprising:
placing at least one of said circuit boards so that its thickness direction is orthogonal to the magnetic field of at least one of said electromagnetic coils. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
Specification