3DIC Packages with Heat Dissipation Structures
First Claim
1. A package comprising:
- a first die;
a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises;
a first portion overlapped by the first die; and
a second portion extending laterally beyond a respective edge of the first die;
a first Thermal Interface Material (TIM) over and contacting a top surface of the first die;
a heat dissipating lid comprising a first bottom surface contacting the first TIM;
a second TIM over and contacting the second portion of the second die; and
a heat dissipating ring comprising a portion over and contacting the second TIM, wherein the heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring comprises a plurality of fins and a plurality of recesses separating the plurality of fins from each other.
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Accused Products
Abstract
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending laterally beyond a respective edge of the first die. The package further includes a first Thermal Interface Material (TIM) over and contacting a top surface of the first die, a heat dissipating lid having a first bottom surface contacting the first TIM, a second TIM over and contacting the second portion of the second die, and a heat dissipating ring having a portion over and contacting the second TIM. The heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring has a plurality of fins and a plurality of recesses separating the plurality of fins from each other.
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Citations
20 Claims
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1. A package comprising:
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a first die; a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises; a first portion overlapped by the first die; and a second portion extending laterally beyond a respective edge of the first die; a first Thermal Interface Material (TIM) over and contacting a top surface of the first die; a heat dissipating lid comprising a first bottom surface contacting the first TIM; a second TIM over and contacting the second portion of the second die; and a heat dissipating ring comprising a portion over and contacting the second TIM, wherein the heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring comprises a plurality of fins and a plurality of recesses separating the plurality of fins from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A package comprising:
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a die stack comprising a plurality of dies; a die underlying and bonded to the die stack, wherein the die comprises; a first portion overlapped by the die stack; and a second portion not overlapped by the die stack; a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack; a heat dissipating lid; a second TIM over and contacting the second portion of the die; and a heat dissipating ring having a portion encircling the heat dissipating lid, wherein a top surface of the heat dissipating lid and a top surface of the heat dissipating ring are coplanar with each other, and both the heat dissipating lid and the heat dissipating ring comprise fins and recesses separating the fins from each other. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A package comprising:
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a package substrate; a die overlying and bonded to the package substrate; a heat dissipating lid overlapping the die; a first Thermal Interface Material (TIM) over and contacting a top surface of the die; and a heat dissipating ring encircling the heat dissipating lid, wherein the heat dissipating ring is joined to the die through the first TIM, and the heat dissipating ring comprises first fins and first recesses separating the first fins from each other, and bottoms of the first recesses are lower than the heat dissipating lid. - View Dependent Claims (17, 18, 19, 20)
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Specification