LIGHT SOURCE MODULE, DISPLAY PANEL, AND DISPLAY APPARATUS INCLUDING THE SAME

• US 20170148771A1
• Filed: 08/02/2016
• Published: 05/25/2017
• Est. Priority Date: 11/19/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: CHA, Nam Goo, KIM, Yong II, LIM, Wan tae
• Granted Patent: US 9,825,014 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/00 Printed circuits
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/083 Magnetic materials
• CPC Class Codes: H05K 2201/0939 Curved pads, e.g. semi-circular or elliptical pads or lands
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 2203/168 Wrong mounting prevention
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

Claims

1. A light source module, comprising:

a circuit board including at least one chip mounting region, of the at least one chip mounting region including at least one connection pad;

at least one alignment component on the at least one chip mounting region, the at least one alignment component including a convex shape or a concave shape; and

at least one light emitting diode (LED) chip on the at least one chip mounting region, the at least one LED chip including at least one electrode, the at least one electrode configured to be electrically connected to the at least one connection pad of the at least one chip mounting region, the at least one LED chip being coupled to at least one alignment component of the at least one chip mounting region.

2. The light source module of claim 1, wherein,

the at least one alignment component includes the convex shape, and

the at least one LED chip includes at least one alignment recess, the at least one alignment recess being configured to be coupled to the at least one alignment component of the at least one chip mounting region.

3. The light source module of claim 2, wherein alignment components are on respective edges of the at least one chip mounting region.

4. The light source module of claim 2, wherein,

the at least one LED chip includes,

a light transmitting substrate, and

a semiconductor stack on the light transmitting substrate, and

the at least one alignment recess extends from points on edges of the light transmitting substrate of the at least one LED chip to points on edges of the light transmitting substrate of the at least one LED chip adjacent thereto in the semiconductor stack of the at least one LED chip.

5. The light source module of claim 2, wherein the at least one LED chip further includes at least one alignment pad on the at least one alignment recess.

6. The light source module of claim 5, wherein at least one of the at least one alignment component and the at least one alignment pad includes a magnetic body.

7. The light source module of claim 1, wherein at least one of the at least one connection pad and the at least one electrode includes a magnetic body.

8. The light source module of claim 1, further comprising:

a reflective guide layer on the circuit board and surrounding the at least one LED chip.

9. (canceled)

10. A light emitting diode (LED) display panel, comprising:

a circuit board including a at least one pixel region, the at least one pixel region including at least one chip mounting region, the at least one chip mounting region including at least one connection pad;

at least one alignment component on the at least one chip mounting region, the at least one alignment component including a convex shape or a concave shape; and

at least one LED chip on the at least one chip mounting region, the at least one LED chip including,

at least one electrode configured to be electrically connected to the at least one connection pad of the at least one chip mounting region, and the at least one LED chip being configured to be coupled to the at least one alignment component of the at least one chip mounting region.

11. The LED display panel of claim 10, wherein,

the at least one alignment component includes at least one alignment post structure on at least one edge of at least one chip mounting region, and

the at least one LED chip includes at least one alignment recess configured to be coupled to at least one alignment post structure of the at least one chip mounting region, respectively.

12. The LED display panel of claim 11, wherein,

the at least one LED chip includes,

a light transmitting substrate, and

a semiconductor stack on the light transmitting substrate, and

the at least one alignment recess extends from points on edges of the light transmitting substrate of the at least one LED chip to points on edges of the light transmitting substrate of the at least one LED chip adjacent thereto in the semiconductor stack of the at least one LED chip.

13. The LED display panel of claim 11, wherein,

the at least one LED chip further includes at least one alignment pad on the at least one alignment recess, and

at least one of the at least one alignment component and the at least one alignment pad includes a magnetic body.

14. The LED display panel of claim 10, wherein at least one of the at least one connection pad and the at least one electrode includes a magnetic body.

15. The LED display panel of claim 10, wherein the at least one electrode includes at least one conductive magnetic body layer.

16. The LED display panel of claim 10, wherein,

the at least one LED chip includes a first surface, and the at least one LED chip is configured to be on the circuit board such that the first surface of the at least one LED chip is a proximate surface of the at least one LED chip, relative to the circuit board;

the at least one connection pad includes a first connection pad and a second connection pad;

the at least one electrode is on the first surface; and

the at least one electrode includes a first electrode and a second electrode, the first electrode and the second electrode being configured to be connected to the first connection pad and the second connection pad, respectively.

17. The LED display panel of claim 10, wherein,

the at least one LED chip includes a first surface, and the at least one LED chip is configured to be on the circuit board such that the first surface of the at least one LED chip is a proximate surface of the at least one LED chip, relative to the circuit board;

the at least one LED chip includes a second surface, the second surface being an opposing surface, relative to the first surface;

the least one electrode includes a first electrode on the first surface; and

the at least one LED chip further includes a second electrode, the second electrode being on the second surface.

18. The LED display panel of claim 17, further comprising:

an electrode wiring layer configured to interconnect the second electrodes of each LED chip of the at last one LED chip.

19-22. -22. (canceled)

23. A light emitting diode (LED) chip, comprising:

a light transmitting substrate;

a semiconductor stack on the light transmitting substrate; and

at least one electrode on at least a portion of the semiconductor stack, the at least one electrode configured to couple with at least one connection pad of a circuit board to form a complementary fit, such that

a sidewall of the at least one electrode is in flush contact with a sidewall of the at least one connection pad, and

at least a portion of the at least one electrode is co-planar with at least one portion of the at least one connection pad.

24. The LED chip of claim 23, wherein the at least one electrode includes a magnetic body.

25. The LED chip of claim 23, wherein the at least one electrode includes at least one conductive magnetic body layer.