SPATIAL POWER COMBINER

• US 20170149113A1
• Filed: 11/21/2016
• Published: 05/25/2017
• Est. Priority Date: 11/23/2015
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission), Microwave Characterization Center, Universite Sciences Technologies LILL
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission), Microwave Characterization Center, Universite Sciences Technologies LILL
• Inventors: THEVENEAU, Hadrien, WERQUIN, Matthieu, GAQUIRE, Christophe
• Granted Patent: US 10,326,191 B2
• Time in Patent Office: Days
• CPC Class Codes: H01P 1/23 using ferromagnetic material
• CPC Class Codes: H01P 1/30 for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability H01P1/04, H01P1/08 take precedence
• CPC Class Codes: H01P 3/081 Microstriplines
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H01P 5/12 Coupling devices having more than two ports H01P5/04 takes precedence
• CPC Class Codes: H01P 5/16 Conjugate devices, i.e. devices having at least one port decoupled from one other port

Abstract

A spatial power combiner includes several inputs to which are respectively linked a plurality of transmission lines, and an output. A body defines a cavity and the plurality of transmission lines pass longitudinally through the cavity and are disposed around an absorbent member also extending longitudinally in the cavity. A power amplification set includes the spatial power combiner and an amplification structure at the input of the spatial power combiner.

Claims

1. A spatial power combiner comprising:

a plurality of inputs to which a set of transmission lines are respectively linked;

an output; and

a body defining a cavity,

wherein the set of transmission lines pass longitudinally through the cavity and are disposed around an absorbent member also extending longitudinally in the cavity.

2. The spatial power combiner according to claim 1, wherein a length of the absorbent member is equal to a length of the transmission lines.

3. The spatial power combiner according to claim 1, wherein a length of the absorbent member is less than a length of the transmission lines.

4. The spatial power combiner according to claim 3, wherein the absorbent member extends from the input of the spatial power combiner.

5. The spatial power combiner according to claim 3, wherein the absorbent member extends from the output of the spatial power combiner.

6. The spatial power combiner according to claim 1 further comprising heat dissipation device extending longitudinally in the cavity, the absorbent member surrounding the dissipation device.

7. The spatial power combiner according to claim 6, wherein the heat dissipation means comprises a metal rod.

8. The spatial power combiner according to claim 1, wherein the transmission lines comprise microstrip transmission lines.

9. The spatial power combiner according to claim 1, wherein the plurality of inputs have a low impedance.

10. The spatial power combiner according to claim 1 further comprising a heat evacuation module.

11. The spatial power combiner according to claim 1 further comprising an impedance preadaptation module at the input, the impedance preadaptation module comprising first portions of the plurality of transmission lines.

12. The spatial power combiner according to claim 11, wherein each first portion of the plurality of transmission lines comprise a set of layers, the set of layers comprising:

at least one first conductive layer transporting a signal and having a width the reduces along the first portion of the plurality of transmission lines; and

at least one second conductive layer serving as a reference for potential and comprising an opening having a width that increases along the first portion of the plurality of transmission lines.

13. The spatial power combiner according to claim 12, wherein the set of layers comprises a third conductive layer serving as a reference for potential.

14. The spatial power combiner according to claim 11, wherein the impedance preadaptation module comprises a support carrying the first portions of the plurality of transmission lines, the support including a set of hollows, wherein the first portion of each of the plurality of transmission lines are respectively disposed in a hollow of the set of hollows.

15. A power amplification set including the spatial power combiner in accordance with claim 1, and an amplification structure at the input of the spatial power combiner, the amplification structure comprising a plurality of inputs and a plurality of outputs, wherein the plurality of outputs are respectively linked to the plurality of inputs of the spatial power combiner.

16. The power amplification set according to claim 15, wherein the amplification structure comprises a plurality of power amplifiers, each power amplifier linked to an output of the plurality of outputs of the amplification structure.

17. The power amplification set according to claim 16, wherein the plurality of outputs of the power amplifiers have low impedance.