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DENSIFIED FOAM FOR THERMAL INSULATION IN ELECTRONIC DEVICES

  • US 20170150651A1
  • Filed: 11/21/2016
  • Published: 05/25/2017
  • Est. Priority Date: 11/19/2015
  • Status: Active Grant
First Claim
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1. A heat spreading and insulating material comprising:

  • an insulating layer formed from a densified sheet of polyimide open cell foam, said densified sheet having a first density between 25-60 kg/m3, said densified sheet having an outwardly facing surface and an oppositely located inwardly facing surface, said outwardly facing surface being spaced from said inwardly facing surface to define a first thickness;

    said insulating layer having further densified areas where said outwardly facing surface is spaced from said inwardly facing surface to define a second thickness, said second thickness being smaller than said first thickness;

    a first adhesive layer having a first adhesive surface and an oppositely located second adhesive surface, said inwardly facing surface of said insulating layer adheredly contacting said first adhesive surface;

    a heat spreading layer formed from a material that conducts heat and having an adhesive facing surface and an oppositely located component facing surface, said adhesive facing surface separated from said component facing surface to define a thickness, said adhesive facing surface adheredly contacting said second adhesive surface of said first adhesive layer.

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