×

SYSTEMS, DEVICES, AND METHODS FOR HIGH-THROUGHPUT THREE-DIMENSIONAL PRINTING

  • US 20170151704A1
  • Filed: 09/09/2016
  • Published: 06/01/2017
  • Est. Priority Date: 12/01/2015
  • Status: Active Grant
First Claim
Patent Images

1. A high-throughput extrusion system, comprising:

  • an extruder;

    a pre-heater in fluid communication with the extruder; and

    a liquefier in fluid communication with the pre-heater,wherein the extruder is configured to advance a filament through the pre-heater and the liquefier towards a build platform,wherein the pre-heater is configured to volumetrically raise a temperature of filament received from the extruder to at least a desired pre-heat temperature, andwherein the liquefier is configured to maintain or raise the temperature of the filament that passed through the pre-heater to at least a desired melt temperature prior to the filament exiting the liquefier, towards a build platform.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×