METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

• US 20170154880A1
• Filed: 11/30/2016
• Published: 06/01/2017
• Est. Priority Date: 11/30/2015
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: OZEKI, Kenji, FUKUTA, Hiroki
• Granted Patent: US 10,461,065 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/26155 Reinforcing structures
• CPC Class Codes: H01L 2224/26175 Flow barriers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/92225 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/26 Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• CPC Class Codes: H01L 29/866 : Zener diodes
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/1304 : Transistor
• CPC Class Codes: H01L 2924/1426 : Driver
• CPC Class Codes: H01L 2924/1811 : Structure
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2933/0033 : relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 : relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/0095 : Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

Claims

1. A method of manufacturing a light emitting device, the method comprising:

mounting a plurality of light emitting elements on a collective substrate;

arranging at least one light transmissive member for each light emitting device on an upper surface of each of the plurality of light emitting elements;

arranging a first protruding member that surrounds the plurality of light emitting elements on an upper surface of the collective substrate;

arranging a second protruding member between the plurality of light emitting elements on the upper surface of the collective substrate;

after the arranging the first protruding member and the second protruding member, forming a cover member that covers an upper end of the second protruding member, the light emitting elements, and a lateral surface of the light transmissive member in a region surrounded by the first protruding member; and

singulating the light emitting devices by dividing the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member;

wherein an upper end of the second protruding member is located in the region surrounded by the first protruding member so as to be lower than an upper end of the first protruding member but higher than the upper surface of each of the light emitting elements, and

wherein the second protruding member is harder than the cover member.

2. The method of manufacturing a light emitting device according to claim 1, wherein the upper end of the first protruding member is located lower than an upper surface of the light transmissive member.

3. The method of manufacturing a light emitting device according to claim 1, wherein a resin material is used for the first protruding member.

4. The method of manufacturing a light emitting device according to claim 1, wherein a resin material is used for the second protruding member.

5. The method of manufacturing a light emitting device according to claim 1, wherein the first protruding member and the second protruding member are integrally formed.

6. The method of manufacturing a light emitting device according to claim 1,

wherein, in the arranging the first protruding member, the first protruding member is formed by supplying an uncured resin material on the collective substrate in two layers, and wherein, in the arranging the second protruding member, the second protruding member is formed by supplying an uncured resin material on the collective substrate in one layer.

7. The method of manufacturing a light emitting device according to claim 1, wherein a thermosetting resin is used for each of the first protruding member, the second protruding member, and the cover member, and the first protruding member, the second protruding member, and the cover member are formed by arranging an uncured resin material for respective members and then heating the uncured resin material to cure the uncured resin material.

8. The method of manufacturing a light emitting device according to claim 1, wherein the arranging the second protruding member is performed after the arranging the first protruding member is performed.

9. The method of manufacturing a light emitting device according to claim 1, wherein, in the forming the cover member, a resin material that contains a light reflective substance is used for the cover member.

10. The method of manufacturing a light emitting device according to claim 1, wherein the light transmissive member contains a wavelength conversion substance configured to convert light emitted by the light emitting element to light having a different wavelength.

11. The method of manufacturing a light emitting device according to claim 1, wherein, in the forming the cover member, the cover member is formed by supplying an uncured resin material to meander across the second protruding member from above the second protruding member, and then curing the material.

12. The method of manufacturing a light emitting device according to claim 1,

wherein, in the mounting the light emitting elements, in a pair of light emitting devices formed adjacently to each other on the collective substrate, in a plan view, the light emitting elements are arranged so as to be substantially axisymmetrical with respect to a boundary between the pair of light emitting devices adjacent to each other, and

wherein, in the arranging the second protruding member, the second protruding member is formed on the boundary between the pair of light emitting devices adjacent to each other.

13. The method of manufacturing a light emitting device according to claim 12,

wherein, before the forming the cover member, a semiconductor element different from the light emitting element is arranged in each of the pair of light emitting devices between the light emitting element and the boundary between the pair of light emitting devices adjacent to each other, and

wherein, in the step of forming the cover member, the cover member is formed so as to cover an upper end of the semiconductor element.

14. The method of manufacturing a light emitting device according to claim 1, wherein, in the arranging the light transmissive member, one light transmissive member is arranged on each of the plurality of light emitting elements.

15. The method of manufacturing a light emitting device according to claim 1, further comprising, before the forming the cover member, arranging an underfill between the upper surface of the collective substrate and a lower surface of each of the light emitting elements.

16. The method of manufacturing a light emitting device according to claim 15, wherein the underfill is arranged to further cover a lateral surface of the light transmissive member.

17. The method of manufacturing a light emitting device according to claim 15, wherein the underfill has light reflectivity.

18. A method of manufacturing a light emitting device, the method comprising:

mounting a plurality of light emitting elements on a substrate;

arranging one light transmissive member on an upper surface of each of the light emitting elements;

arranging an underfill covering an upper surface of the substrate, a lateral surface of each of the light emitting elements, and a lateral surface of the light transmissive member between the light transmissive member; and

arranging a cover member covering an upper surface of the underfill.

19. A light emitting device comprising:

a substrate;

a plurality of light emitting elements mounted on the substrate;

light transmissive members each disposed on an upper surface of each of the plurality of light emitting elements;

an underfill covering an upper surface of the substrate, a lateral surface of each of the plurality of light emitting elements, and a lateral surface of the light transmissive member between the light transmissive member; and

a cover member covering an upper surface of the underfill and having a hardness greater than a hardness of the underfill;

wherein

in a plan view, at least a portion of a periphery of the cover member coincides with a periphery of the substrate, and a portion of the underfill arranged on the periphery of the substrate that coincides the at least the portion of periphery of the cover member has a thickness of 10 μ

m or smaller.

20. The light emitting element according to claim 19, further comprising, on the periphery of the substrate, a protruding member buried in the cover member and harder than the cover member.

21. The light emitting element according to claim 19, wherein the underfill contains a light reflecting substance.

22. The light emitting element according to claim 19, wherein, between the light transmissive layers, the interface between the underfill and the cover member is a convex surface curved toward the mount substrate.