WIRING BOARD SOLDERED WITH LEAD WIRE AND ELECTRONIC DEVICE COMPRISING WIRING BOARD
First Claim
1. An electronic device comprising:
- lead wire; and
a wiring board soldered with said lead wire,wherein a surface of said wiring board is formed with a land part by exposing a conductor,wherein the land part is formed with a groove part, which is a region not including the conductor, for positioning of said lead wire along a leading direction, andwherein said lead wire mounted to the groove part is soldered to the land part in such a manner as to cover the groove part.
1 Assignment
0 Petitions
Accused Products
Abstract
A wiring board and an electronic device which suppress variation in a leading direction of lead wire after soldering and variation in a tip position of the lead wire and keep a height of a soldered lead wire low while suppressing variation in the height. A wiring board is soldered with lead wire. A surface of the wiring board is formed with a land part by exposing a conductor. The land part is formed with a groove part, which is a region not including the conductor, for positioning of the lead wire along a leading direction. The lead wire mounted to the groove part is soldered to the land part in such a manner as to cover the groove part.
2 Citations
7 Claims
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1. An electronic device comprising:
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lead wire; and a wiring board soldered with said lead wire, wherein a surface of said wiring board is formed with a land part by exposing a conductor, wherein the land part is formed with a groove part, which is a region not including the conductor, for positioning of said lead wire along a leading direction, and wherein said lead wire mounted to the groove part is soldered to the land part in such a manner as to cover the groove part. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A wiring board soldered with lead wire, comprising:
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a land part where a conductor is exposed, said land part formed on a surface of the wiring board, wherein said land part is formed with a groove part, which is a region not including the conductor, for positioning of the lead wire along a leading direction, and wherein the lead wire mounted to the groove part is soldered to said land part in such a manner as to cover the groove part.
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Specification