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SEMICONDUCTOR DEVICE

  • US 20170162500A1
  • Filed: 09/07/2016
  • Published: 06/08/2017
  • Est. Priority Date: 12/03/2015
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a substrate;

    a decoupling capacitor disposed on the substrate;

    a first connection pad vertically overlapping with the decoupling capacitor;

    a passivation layer exposing a portion of the first connection pad; and

    a first solder bump disposed on the first connection pad and covering a portion of a top surface of the passivation layer.

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