Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same

• US 20170162542A1
• Filed: 02/22/2017
• Published: 06/08/2017
• Est. Priority Date: 12/11/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Huang, Szu-Po, Chen, Kim Hong, Jeng, Shin-Puu, Hung, Wensen
• Granted Patent: US 10,062,665 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2023/4056 heatsink to additional heatsink
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

Claims

1. A package comprising:

a first die coupled to a first side of a substrate;

a second die coupled to the first side of the substrate;

a heat dissipating structure attached to the first side of the substrate, the heat dissipating structure comprising;

a contour ring attached to the first side of the substrate and around the first die and the second die; and

a contour lid attached to the contour ring and over the first die and the second die, the contour lid having an opening exposing the second die; and

a heat spreader over the heat dissipating structure and having a first portion and a second portion, the first portion being attached to an upper surface of the contour lid, and the second portion extending into the opening and attached to the second die.

2. The package of claim 1, wherein the heat spreader further comprises a cooling element proximate a top surface of the heat spreader.

3. The package of claim 1, wherein the heat spreader extends laterally beyond outer sidewalls of the heat dissipating structure.

4. The package of claim 1, wherein the heat spreader further comprises a thermal barrier disposed between the first portion of the heat spreader and the second portion of the heat spreader.

5. The package of claim 4, wherein the thermal barrier comprises a first material, wherein the first portion of the heat spreader and the second portion of the heat spread comprise a second material, wherein a first thermal conductivity of the first material is lower than a second thermal conductivity of the second material.

6. The package of claim 4, wherein thermal barrier comprises a material with a thermal conductivity less than about 0.05 watts per meter kelvin.

7. The package of claim 4, wherein the thermal barrier comprises air gaps.

8. The package of claim 7, wherein the air gaps comprise a plurality of through-holes extending through the heat spreader and disposed between the first die and the second die.

9. The package of claim 8, wherein the air gaps comprise a continuous trench between the first die and the second die.

10. The package of claim 1, wherein the first die has a first height, and wherein the second die has a second height different from the first height.

11. The package of claim 1, wherein a power consumption of the first die is different from a power consumption of the second die.

12. The package of claim 1 further comprising:

a first thermal interface material (TIM) between the first die and the contour lid; and

a second TIM between the second die and the heat spreader, wherein the second TIM is spaced apart from the first TIM.

13. A package comprising:

a first die and a second die, wherein the first die and the second die are bonded to a package component;

a ring attached to the package component and encircling the first die and the second die; and

a lid attached to an upper surface of the ring and disposed over the first die and second die, wherein the lid comprises;

a first thermal conductive portion;

a second thermal conductive portion; and

a first thermal barrier between and contacting the first thermal conductive portion and the second thermal conductive portion, wherein each of the first thermal conductive portion and the second thermal conductive portion has a thermal conductivity higher than a thermal conductivity of the first thermal barrier.

14. The package of claim 13, wherein the first thermal barrier is disposed directly over a spacing between the first die and the second die.

15. The package of claim 13, further comprising a first thermal interface material (TIM) between and contacting the lid and top surfaces of the first die and the second die.

16. The package of claim 15, wherein the first TIM is discontinuous.

17. The package of claim 13, further comprising a composite heat spreader over the lid, wherein the composite heat spreader comprises:

a third thermal conductive portion over the first thermal conductive portion;

a fourth thermal conductive portion over the second thermal conductive portion; and

a second thermal barrier between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier comprises a different material than the third thermal conductive portion and the fourth thermal conductive portion.

18. A method comprising:

bonding a first die and a second die to a first side of a substrate;

attaching a heat conductive feature to the first side of the substrate, wherein the heat conductive feature surrounds the first die and the second die, wherein the heat conductive feature comprises a lid, the lid having a first portion, a second portion, and an opening between the first portion and the second portion, wherein the first portion of the lid covers the first die, and the opening of the lid exposes the second die;

forming a first thermal interface material (TIM) over the first portion of the lid;

forming an adhesive over the second portion of the lid, wherein a thermal conductivity of the adhesive is lower than a thermal conductivity of the first TIM; and

attaching a heat spreader having a first thermal conductive portion, a second thermal conductive portion and a thermal barrier to the lid, wherein the thermal barrier is between and contacts the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal conductive portion is over the first portion of the lid with the first TIM disposed therebetween, wherein the second thermal conductive portion is over the second portion of the lid with the adhesive disposed therebetween.

19. The method of claim 18, wherein the second thermal conductive portion of the heat spreader extends into the opening of the lid and is thermally coupled to the second die via a second TIM.

20. The method of claim 18, further comprising forming a third TIM over the first die, wherein the third TIM is between and contacts the first die and the first portion of the lid.