WIRELESS POWER TRANSMITTER

• US 20170163091A1
• Filed: 12/02/2016
• Published: 06/08/2017
• Est. Priority Date: 12/03/2015
• Status: Active Grant

• Current Assignee: Nera Innovations Limited (Atlantic IP Services Limited)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: PARK, Yu Ri
• Granted Patent: US 10,243,400 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices

Abstract

Embodiments provide a wireless power transfer technology, and more particularly, provide a wireless power transmitter, which may improve wireless power transfer efficiency, thereby achieving increased performance. The wireless power transmitter includes a Printed Circuit Board (PCB), a first transmission coil attached to a first surface of the PCB, a second transmission coil and a third transmission coil, each attached to a second surface of the PCB so as to overlap the first transmission coil, and a control circuit board for controlling wireless power transfer through the first to third transmission coils.

Claims

1. A wireless power transmitter comprising:

a Printed Circuit Board (PCB);

a first transmission coil attached to a first surface of the PCB;

a second transmission coil and a third transmission coil, each attached to a second surface of the PCB so as to overlap the first transmission coil; and

a control circuit board for controlling wireless power transfer through the first to third transmission coils.

2. The wireless power transmitter according to claim 1, wherein the first surface is a surface facing an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface at an opposite side of the interface surface.

3. The wireless power transmitter according to claim 1, wherein the first surface is a surface at an opposite side of an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface facing the interface surface.

4. The wireless power transmitter according to claim 1, wherein each of the first to third transmission coils is formed by symmetrically etching opposite surfaces of a copper plate.

5. The wireless power transmitter according to claim 1, wherein each of the first to third transmission coils is connected to the control circuit board via a connector inserted into the PCB.

6. The wireless power transmitter according to claim 1, wherein the second transmission coil and the third transmission coil are spaced apart from each other, and

wherein an overlapping area between the first transmission coil and the second and third transmission coils is 50% or more of an entire area of the first transmission coil.

7. The wireless power transmitter according to claim 6, wherein the overlapping area between the first transmission coil and the second and third transmission coils is 90% or more of the entire area of the first transmission coil.

8. The wireless power transmitter according to claim 5, wherein the connector is located closest to the first transmission coil, among the first transmission coil, the second transmission coil and the third transmission coil.

9. A wireless power transmitter comprising:

a first layer and a second layer, each including at least one transmission coil;

a PCB having a first surface and a second surface attached to the first layer and the second layer respectively; and

a control circuit board for controlling wireless power transfer through the transmission coil.

10. The wireless power transmitter according to claim 9, wherein the transmission coil included in the first layer and the transmission coil included in the second layer overlap each other.

11. The wireless power transmitter according to claim 9, wherein the transmission coil is formed by symmetrically etching opposite surfaces of a copper plate.

12. The wireless power transmitter according to claim 9, wherein the first surface is a surface facing an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface at an opposite side of the interface surface.

13. The wireless power transmitter according to claim 9, wherein the first surface is a surface at an opposite side of an interface surface on which a wireless power receiver is placed, and

wherein the second surface is a surface facing the interface surface.

14. The wireless power transmitter according to claim 9, wherein the transmission coil is connected to the control circuit board via a connector inserted into the PCB.

15. The wireless power transmitter according to claim 9, wherein the transmission coil, included in the first layer, includes a second transmission coil and a third transmission coil spaced apart from each other, and the transmission coil, included in the second layer, is a first transmission coil, and

wherein an overlapping area between the first transmission coil and the second and third transmission coils is 50% or more of an entire area of the first transmission coil.

16. The wireless power transmitter according to claim 15, wherein the overlapping area between the first transmission coil and the second and third transmission coils is 90% or more of the entire area of the first transmission coil.

17. The wireless power transmitter according to claim 14, wherein the transmission coil, included in the first layer, includes a second transmission coil and a third transmission coil spaced apart from each other, and the transmission coil, included in the second layer, is a first transmission coil, and

wherein the connector is located closest to the first transmission coil, among the first transmission coil, the second transmission coil and the third transmission coil.