EFFICIENT IGBT SWITCHING

• US 20170163254A1
• Filed: 02/17/2017
• Published: 06/08/2017
• Est. Priority Date: 01/09/2012
• Status: Active Grant

• Current Assignee: EHT Ventures LLC
• Original Assignee: Eagle Harbor Technolologies, Inc.
• Inventors: Carscadden, John G., Prager, James, Ziemba, Timothy, Miller, Kenneth E.
• Granted Patent: US 10,389,345 B2
• Time in Patent Office: Days
• CPC Class Codes: H01H 9/54 Circuit arrangements not adapted to a particular application of the switching device and for which no provision exists elsewhere
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 29/7393 Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
• CPC Class Codes: H03K 17/0406 in composite switches
• CPC Class Codes: H03K 17/567 Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
• CPC Class Codes: H03K 2217/0036 Means reducing energy consumption

Abstract

Embodiments of the invention provide IGBT circuit modules with increased efficiencies. These efficiencies can be realized in a number of ways. In some embodiments, the gate resistance and/or voltage can be minimized. In some embodiments, the IGBT circuit module can be switched using an isolated receiver such as a fiber optic receiver. In some embodiments, a single driver can drive a single IGBT. And in some embodiments, a current bypass circuit can be included. Various other embodiments of the invention are disclosed.

Claims

1. A solid-state switch circuit module comprising a circuit board;

a solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;

a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and

a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver,

wherein the circuit module is configured to couple with a load between the emitter and the collector.

2. The solid-state switch circuit module according to claim 1, wherein the solid-state switch includes a manufacturer-specified current rise time, and wherein the voltage at the gate is brought to a full voltage in a time less than the manufacturer-specified current rise time.

3. The solid-state switch circuit module according to claim 1, wherein the solid-state switch includes a manufacturer-specified current fall time, and wherein the voltage at the gate is discharged in a time less than the manufacturer-specified current fall time.

4. The solid-state switch circuit module according to claim 1, wherein the solid-state switch includes a manufacturer-specified current rise time, and wherein the voltage between the collector and the emitter is brought to a minimum voltage in a time less than the manufacturer-specified current rise time.

5. The solid-state switch circuit module according to claim 1, wherein the solid-state switch circuit module includes an internal circuit module inductance that is greater than 50 nH.

6. The solid-state switch circuit module according to claim 5, wherein the internal circuit module inductance includes either or both an internal solid-state switch inductance and a stray circuit module inductance.

7. The solid-state switch circuit module according to claim 1, further comprising a current bypass circuit between the collector and the emitter.

8. The solid-state switch circuit module according to claim 1, wherein the driver is coupled with a single solid-state switch.

9. The solid-state switch circuit module according to claim 1, wherein the driver is coupled with a pre-driver.

10. The solid-state switch circuit module according to claim 1, wherein the first trace directly couples the driver with the gate without an additional component.

11. The solid-state switch circuit module according to claim 1, wherein the first trace directly couples the driver with the gate without a resistor.

12. The solid-state switch circuit module according to claim 1, wherein the solid-state switch has a manufacturer-specified switching loss, and the switching loss of the solid-state switch circuit module is less than the manufacturer-specified switching loss.

13. The solid-state switch circuit module according to claim 1, wherein the solid-state switch has a manufacturer-specified rise time, and the rise time of the solid-state switch circuit module is less than the manufacturer-specified rise time.

14. The solid-state switch circuit module according to claim 1, wherein the solid-state switch has a manufacturer-specified fall time, and the fall time of the solid-state switch circuit module is less than the manufacturer-specified fall time.

15. The solid-state switch circuit module according to claim 1, wherein the solid-state switch has a manufacturer specified turn-on delay time, and the turn-on delay time of the solid-state switch circuit module is less than the manufacturer specified turn-on delay time.

16. The solid-state switch circuit module according to claim 1, wherein the solid-state switch has a manufacturer specified turn-off delay time, and the turn-off delay time of the solid-state switch circuit module is less than the manufacturer specified turn-off delay time.

17. The solid-state switch circuit module according to claim 1, wherein the turn-off delay time is less than 100 ns.

18. The solid-state switch circuit module according to claim 1, wherein the turn-on delay time is less than 40 ns.

19. The solid-state switch circuit module according to claim 1, wherein the solid-state switch comprises an IGBT.

20. A solid-state switch circuit module comprising

a circuit board;

an solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;

a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and

a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the first trace has an inductance less than 100 nH,

wherein the circuit module is configured to couple with a load between the emitter and the collector.

21. A solid-state switch circuit module comprising

a circuit board;

an solid-state switch coupled with the circuit board having a gate, a collector, and an emitter;

a driver that provides current to the gate of the solid-state switch coupled with the circuit board; and

a plurality of traces, wherein a first trace of the plurality of traces electrically couples the gate and the driver, wherein the first trace has a resistance less than 1 ohm,

wherein the circuit module is configured to couple with a load between the emitter and the collector.