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Metallizing MEMS Devices

  • US 20170166439A1
  • Filed: 12/09/2015
  • Published: 06/15/2017
  • Est. Priority Date: 12/09/2015
  • Status: Active Grant
First Claim
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1. A method of fabricating a micromachined device having a metal interconnection structure, comprising:

  • fabricating a substrate having at least one semiconductor interconnection structure, the semiconductor interconnection structure having an electrical resistance;

    fabricating a micromachined structure on the substrate; and

    after fabricating the micromachined structure, metallizing the semiconductor interconnection structure to form a conductive metal interconnection structure having an electrical resistance that is lower than the electrical resistance of the semiconductor interconnection structure.

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