MANUFACTURING METHOD OF MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

• US 20170166443A1
• Filed: 06/29/2016
• Published: 06/15/2017
• Est. Priority Date: 12/11/2015
• Status: Active Grant

• Current Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Original Assignee: Hyundai Motor Company (Hyundai Motor Group)
• Inventors: YOO, Ilseon
• Granted Patent: US 9,828,241 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2201/013 Etching
• CPC Class Codes: B81C 2201/0159 Lithographic techniques not provided for in B81C2201/0157
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: B81C 2203/036 Fusion bonding

Abstract

A manufacturing method of a MEMS sensor includes forming a first substrate, wherein the first substrate includes a lower electrode provided at one surface thereof, forming a second substrate, wherein the second substrate includes a first concave-convex portion provided at one surface thereof, first-bonding one surface of the first substrate and one surface of the second substrate to face each other, forming a third substrate, wherein the third substrate includes an upper electrode provided at one surface thereof, second-bonding another surface of the second substrate and one surface of the third substrate to face each other, and forming an electrode line on another surface of the third substrate to be connected to the lower electrode and the upper electrode.

Claims

1. A manufacturing method of a MEMS sensor, comprising:

forming a first substrate, wherein the first substrate includes a lower electrode provided at one surface thereof;

forming a second substrate, wherein the second substrate includes a first concave-convex portion provided at one surface thereof;

first-bonding one surface of the first substrate and one surface of the second substrate to face each other;

forming a third substrate, wherein the third substrate includes an upper electrode provided at one surface thereof;

second-bonding another surface of the second substrate and one surface of the third substrate to face each other; and

forming an electrode line on another surface of the third substrate to be connected to the lower electrode and the upper electrode.

2. The manufacturing method of the MEMS sensor of claim 1, wherein the upper electrode is made of polysilicon and is formed by ion-injecting.

3. The manufacturing method of the MEMS sensor of claim 1, wherein the first-bonding step includes anodic bonding and the second-bonding step includes eutectic bonding.

4. The manufacturing method of the MEMS sensor of claim 1, wherein the step of forming the first substrate includes:

preparing the first substrate;

forming a photoresist on the one surface of the first substrate, and then patterning the photoresist;

forming a lower electrode layer on the first substrate and an upper portion of the photoresist; and

forming the lower electrode by removing the patterned photoresist.

5. The manufacturing method of the MEMS sensor of claim 1, wherein the first substrate is a glass substrate.

6. The manufacturing method of the MEMS sensor of claim 1, wherein the step of forming the second substrate includes:

preparing the second substrate;

forming a photoresist on the one surface of the second substrate, and then patterning the photoresist;

forming a plurality of depressions and a plurality of protrusions by using the patterned photoresist as a mask; and

forming a low protrusion by step-etching at least one of the plurality of protrusions.

7. The manufacturing method of the MEMS sensor of claim 6, wherein the low protrusion is bonded to one side of the lower electrode of the first substrate.

8. The manufacturing method of the MEMS sensor of claim 1, further comprising after the step of first-bonding,

forming a photoresist on the other surface of the second substrate, and then pattering the photoresist;

forming a second concave-convex portion including a plurality of depressions and a plurality of protrusions by using the patterned photoresist as a mask; and

forming a sensing portion at a center of the other surface of the second substrate.

9. The manufacturing method of the MEMS sensor of claim 8, wherein the step of forming the sensing portion includes:

forming a metal layer and a photoresist on the other surface of the second substrate, and then patterning the metal layer and the photoresist; and

forming the sensing portion by etching the second substrate while using the patterned metal layer and the patterned photoresist as a mask.

10. The manufacturing method of the MEMS sensor of claim 9, wherein the metal layer is made of at least one of aluminum (Al), copper (Cu), and an alloy thereof.

11. The manufacturing method of the MEMS sensor of claim 1, wherein the step of forming the third substrate includes:

preparing the third substrate;

forming a photoresist on one surface of the third substrate, and then patterning the photoresist;

forming a connecting hole by using the patterned photoresist as a mask;

forming an insulating layer on the one surface and the other surface of the third substrate, respectively;

forming a connecting electrode inside the connecting hole;

forming an upper electrode on the one surface of the third substrate to contact the connecting electrode; and

forming a bonding layer on the upper electrode by using a metal material.

12. The manufacturing method of the MEMS sensor of claim 11, wherein the connecting electrode is made of at least one of copper (Cu) and an alloy thereof.

13. The manufacturing method of the MEMS sensor of claim 11, wherein in the step of second-bonding, the third substrate is bonded to the other surface of the second substrate through the bonding layer of the third substrate.

14. The manufacturing method of the MEMS sensor of claim 1, wherein the step of forming of the electrode line includes:

forming an electrode line layer on the other surface of the third substrate by using a metal material;

forming a photoresist on the electrode line layer, and then patterning the photoresist; and

forming the electrode line to contact the connecting electrode formed in the third substrate by etching the electrode line layer while using the patterned photoresist as a mask.