LIGHT SOURCE MODULE

• US 20170167713A1
• Filed: 10/31/2016
• Published: 06/15/2017
• Est. Priority Date: 12/14/2015
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: HONG, Jaepyo, KIM, Jaechan, KIM, Injoong
• Granted Patent: US 10,228,119 B2
• Time in Patent Office: Days
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/0625 the material diffusing light, e.g. translucent plastics
• CPC Class Codes: F21V 31/00 Gas-tight or water-tight arrangements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 2203/1355 Powder coating of insulating material
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence

Abstract

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

Claims

1. A light source module comprising:

at least one light source configured to emit light;

a heat sink having a surface on which the light source is supported, the heat sink configured to absorb heat from the light source and dissipate the heat to the outside;

an electrical insulating part applied to at least one surface of the heat sink; and

a plating part provided on the insulating part, the plating part comprising;

a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source; and

a diffusion heat dissipation part connected to the contact heat dissipation part to receive heat from the contact heat dissipation part and discharge the heat to the heat sink.

2. The light source module according to claim 1, further comprising a conducting part providing a path for power to be applied to the light source.

3. The light source module according to claim 2, wherein the insulating part is provided with a depression part into which the plating part is provided.

4. The light source module according to claim 2, wherein the conducting part comprises:

at least one light source region on which the light source is mounted; and

a connection region connected to the light source region.

5. The light source module according to claim 4, wherein the light source region comprises:

a first light source mounting part to provide a first electric current to the light source; and

a second light source mounting part to provide a second electric current to the light source.

6. The light source module according to claim 5, wherein the contact heat dissipation part is disposed between the first light source mounting part and the second light source mounting part.

7. The light source module according to claim 2, wherein the conducting part is spaced apart from the diffusion heat dissipation part.

8. The light source module according to claim 2, wherein the diffusion heat dissipation part comprises:

an inner diffusion heat dissipation part provided inside the conducting part; and

an outer diffusion heat dissipation part provided outside the conducting part.

9. The light source module according to claim 8, wherein at least one side of the contact heat dissipation part is connected to at least one of the inner diffusion heat dissipation part and the outer diffusion heat dissipation part.

10. The light source module according to claim 9, wherein the contact heat dissipation part is a bridge connecting the inner diffusion heat dissipation part to the outer diffusion heat dissipation part.

11. The light source module according to claim 1, wherein the heat sink comprises a heat dissipation fin to absorb heat from the heat sink and dissipate the heat to the outside.

12. The light source module according to claim 11, further comprising a lens cover provided at one side of the heat sink and located over the light source to allow light emitted from the light source to be transmitted therethrough.

13. A light source module comprising:

at least one light source configured to emit light;

a heat sink having a surface on which the light source is supported, the heat sink configured to absorb heat from the light source and dissipate the heat to the outside;

an electrical insulating part applied to at least one surface of the heat sink; and

a heat dissipation part provided on the insulating part, the heat dissipation part comprising;

an outer heat dissipation part disposed adjacent to a corner of the heat sink;

an inner heat dissipation part spaced apart from the outer heat dissipation part, the inner heat dissipation part being provided inwardly of the outer heat dissipation part; and

a connection heat dissipation part connecting the outer heat dissipation part to the inner heat dissipation part, the connection heat dissipation part having at least one portion contacting a bottom surface of the light source.

14. The light source module according to claim 13, wherein the insulating part further comprises a conducting part providing a path for power to be applied to the light source, the conducting part being spaced apart from the heat dissipation part, and

wherein the conducting part is located between the outer heat dissipation part and the inner heat dissipation part.

15. The light source module according to claim 14, wherein the conducting part is spaced apart from the connection heat dissipation part.

16. The light source module according to claim 15, wherein the connection heat dissipation part is provided in plurality, and the plurality of connection heat dissipation parts are spaced apart from one another, and

wherein the conducting part is disposed between the connection heat dissipation parts.

17. The light source module according to claim 13, wherein the heat sink comprises:

a heat dissipation fin provided at one side of the heat sink to absorb heat from the heat sink and dissipate the heat to the outside; and

an air hole opened in a vertical direction of the heat sink such that air may pass through the air hole in the heat sink.

18. A light source module comprising:

at least one light source configured to emit light, the at least one light source having at least one heat dissipation pad provided on a bottom surface of the light source;

a heat sink having a surface on which the light source is supported, the heat sink configured to absorb heat from the light source and dissipate the heat to the outside;

an electrical insulating part applied to at least one surface of the heat sink; and

a heat conducting part provided on the insulating part, the heat conducting part comprising;

a contact heat conducting part at least disposed under the light source to contact the heat dissipation pad; and

a first diffusion heat conducting part extending at one side of the contact heat conducting part to discharge heat to at least one surface of the heat sink.

19. The light source module according to claim 18, further comprising a second diffusion heat conducting part extending at an other side of the contact heat dissipation part to discharge heat to at least one other surface of the heat sink.

20. The light source module according to claim 19, wherein the second diffusion heat conducting part is disposed outwardly of the first diffusion heat conducting part.