Universal Surface-Mount Semiconductor Package

• US 20170170144A1
• Filed: 01/25/2017
• Published: 06/15/2017
• Est. Priority Date: 03/09/2013
• Status: Active Grant

• Current Assignee: Adventive Ipbank
• Original Assignee: Adventive Ipbank
• Inventors: Williams, Richard K., Lin, Keng-Hung
• Granted Patent: US 10,032,744 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/268 using electromagnetic radiation, e.g. laser radiation
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/4825 Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
• CPC Class Codes: H01L 21/4828 Etching etching for cleaning without patterning H01L21/4835
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/4111 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4846 : with multiple bonds on the same bonding area
• CPC Class Codes: H01L 2224/48464 : the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49111 : the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 : Fan-out arrangements
• CPC Class Codes: H01L 2224/73221 : Strap and wire connectors
• CPC Class Codes: H01L 2224/73257 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/84801 : Soldering or alloying
• CPC Class Codes: H01L 2224/8485 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85 : using a wire connector
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 23/4952 : the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49551 : characterised by bent parts
• CPC Class Codes: H01L 23/49555 : the bent parts being the outer leads
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49568 : specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49582 : Metallic layers on lead frames
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/37 : of an individual strap connector
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/41 : of a plurality of strap connectors
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/84 : using a strap connector
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

Claims

1. A semiconductor package comprising:

a semiconductor die encapsulated in a plastic body; and

at least two metal leads, each of the leads being partially encapsulated in the plastic body and having a foot, each of the feet having a flat bottom surface, wherein the flat bottom surfaces of all of the feet are coplanar.

2. The semiconductor package of claim 1 wherein the die is mounted on an exposed die pad, the die pad having an exposed flat bottom surface that is coplanar with the flat bottom surface of each of the feet.

3. The semiconductor package of claim 2 wherein at least a portion of each of the feet is thinner than the die pad

4. The semiconductor package of claim 2 wherein at least one of the metal leads is a physical extension of the die pad.

5. The semiconductor package of claim 1 wherein the die is mounted on an unexposed die pad, the die pad having a bottom surface that is covered by the plastic body.

6. The semiconductor package of claim 5 wherein at least one of the metal leads is a physical extension of the unexposed die pad.

7. The semiconductor package of claim 5 wherein an upper surface of each of the feet is located at a level below a top surface of the unexposed die pad.

8. The semiconductor package of claim 5 wherein an upper surface of each of the feet is located at a level below the bottom surface of the unexposed die pad.

9. The semiconductor package of claim 1 wherein the die is mounted on a die pad and one of the leads comprises a lateral extension of the die pad extending outside of the plastic body and having at least two thicknesses.

10. An intermediate semiconductor package structure comprising a metal piece, the metal piece comprising:

a first foot, a first column segment extending upward from the first foot, and a first cantilever segment extending laterally from a top of the first column segment;

a second foot, a second column segment extending upward from the second foot, and a second cantilever segment extending laterally from a top of the second column segment; and

a die pad, wherein each of said first and second cantilever segments extends laterally from the an edge of the die pad.

11. A semiconductor package comprising:

a semiconductor die encapsulated in a plastic body; and

a metal lead, the lead comprising a vertical column segment, a cantilever segment and a foot, a top surface of the vertical column segment being coplanar with a top surface of the cantilever segment, a bottom surface of the vertical column segment being coplanar with a bottom surface of the foot, wherein at least a part of the cantilever segment is encapsulated in the plastic body.

12. The semiconductor package of claim 11 further comprising a second lead comprising a second foot, the foot and the second foot extending outside the plastic body, a bottom surface of the second foot being coplanar with the bottom surface of the foot.

13. The semiconductor package of claim 11 wherein the die is mounted on a conductive die pad, the die pad having a top surface that is coplanar with the top surface of the cantilever segment.

14. The semiconductor package of claim 13 wherein the die pad has a bottom surface covered by the plastic body.

15. The semiconductor package of claim 13 wherein the die pad has a bottom surface that is coplanar with the bottom surface of the foot.

16. The semiconductor package of claim 11 wherein the cantilever segment includes a first portion within the plastic body and a second portion outside of the plastic body.

17. A semiconductor package comprising:

a die pad at least partially encapsulated in a plastic body;

a plurality of metal leads, each of the leads comprising a foot that extends to a location outside the plastic body; and

a tie bar extending laterally from the die pad to a sidewall of the plastic body, an exposed portion of the tie bar being coplanar with the sidewall.

18. The semiconductor package of claim 17 wherein none of the feet protrudes through the sidewall of the package.

19. The semiconductor package of claim 17 wherein the tie bar extends to a corner of the plastic body.

20. The semiconductor package of claim 17 wherein at least one of the feet protrudes through the sidewall of the package.