SEMICONDUCTOR DEVICES AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a plurality of trenches extending into a semiconductor substrate, wherein each trench of the plurality of trenches comprises a plurality of enlarged width regions distributed along the trench, and wherein at least one electrically conductive trench structure is located in each trench of the plurality of trenches;
an electrically insulating layer arranged between the semiconductor substrate and a first electrode structure; and
a vertical electrically conductive structure extending through the electrically insulating layer, wherein the vertical electrically conductive structure forms an electrical connection between the first electrode structure and an electrically conductive trench structure located in a first trench of the plurality of trenches at a first enlarged width region of the plurality of enlarged width regions of the first trench of the plurality of trenches, andwherein the electrically insulating layer is arranged between a second enlarged width region of the plurality of enlarged width regions of the first trench and the first electrode structure or a second electrode structure above the second enlarged width region without any vertical electrical connections through the electrically insulating layer at the second enlarged width region.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes a plurality of trenches extending into a semiconductor substrate. Each trench comprises a plurality of enlarged width regions distributed along the trench. At least one electrically conductive trench structure is located in each trench. The semiconductor device comprises an electrically insulating layer arranged between the semiconductor substrate and an electrode structure. The semiconductor device comprises a vertical electrically conductive structure extending through the electrically insulating layer. The vertical electrically conductive structure forms an electrically connection between the electrode structure and an electrically conductive trench structure located in a first trench of at a first enlarged width region. The electrically insulating layer is arranged between a second enlarged width region of the plurality of enlarged width regions of the first trench and an electrode structure above the second enlarged width region without any vertical electrical connections through the electrically insulating layer at the second enlarged width region.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a plurality of trenches extending into a semiconductor substrate, wherein each trench of the plurality of trenches comprises a plurality of enlarged width regions distributed along the trench, and wherein at least one electrically conductive trench structure is located in each trench of the plurality of trenches; an electrically insulating layer arranged between the semiconductor substrate and a first electrode structure; and a vertical electrically conductive structure extending through the electrically insulating layer, wherein the vertical electrically conductive structure forms an electrical connection between the first electrode structure and an electrically conductive trench structure located in a first trench of the plurality of trenches at a first enlarged width region of the plurality of enlarged width regions of the first trench of the plurality of trenches, and wherein the electrically insulating layer is arranged between a second enlarged width region of the plurality of enlarged width regions of the first trench and the first electrode structure or a second electrode structure above the second enlarged width region without any vertical electrical connections through the electrically insulating layer at the second enlarged width region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for forming a semiconductor device, the method comprising:
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forming an electrically insulating layer between a semiconductor substrate and an electrode structure, wherein the semiconductor substrate comprises a plurality of trenches extending into the semiconductor substrate, wherein each trench of the plurality of trenches comprises a plurality of enlarged width regions distributed along the trench, and wherein at least one electrically conductive trench structure is arranged in each trench of the plurality of trenches; and forming at least one a hole extending through the electrically insulating layer at a first enlarged width region of the plurality of enlarged width regions for forming a vertical electrically conductive structure, wherein the trench remains covered by the electrically insulating layer at a second enlarged width region of the plurality of enlarged width regions during the forming of the at least one hole. - View Dependent Claims (18, 19)
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20. A semiconductor device comprising:
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a plurality of trenches extending into a semiconductor substrate, wherein each trench of the plurality of trenches comprises a plurality of enlarged width regions distributed along the trench, wherein a total number of vertical electrically conductive structures connecting electrically conductive trench structures located within the trenches of the plurality of trenches is less than a number of enlarged width regions of the plurality of trenches.
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Specification