SEMICONDUCTOR DEVICE FOR NEAR-FIELD COMMUNICATION

• US 20170170691A1
• Filed: 11/21/2016
• Published: 06/15/2017
• Est. Priority Date: 12/11/2015
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Chan Yong, KIM, In Hyuk, SONG, Il Jong, LEE, Sang Hyo
• Granted Patent: US 10,256,671 B2
• Time in Patent Office: Days
• CPC Class Codes: H02J 50/20 using microwaves or radio frequency waves
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A semiconductor device is provided. The semiconductor device includes a first coil section that receives a first clock signal from a reader, a power generator that is electrically connected to the first coil section in accordance with a switching operation of a switch, a first near-field communication (NFC) chip that is electrically connected to the power generator and receives electric power in accordance with the first clock signal, a second NFC chip that generates a switching operation control signal for controlling the switching operation of the switch, and a second coil section that is electrically connected to the second NFC chip and receives a second clock signal from the reader.

Claims

1. A semiconductor device comprising:

a first coil section configured to receive a first clock signal from a reader;

a power generator that is electrically connected to the first coil section in accordance with a switching operation of a switch;

a first near-field communication (NFC) chip that is electrically connected to the power generator and configured to receive electric power in accordance with the first clock signal;

a second NFC chip configured to generate a switching operation control signal for controlling the switching operation of the switch; and

a second coil section that is electrically connected to the second NFC chip and configured to receive a second clock signal from the reader.

2. The semiconductor device of claim 1, wherein the second NFC chip is configured to, when the second clock signal includes the switching operation signal of the switch, generate the switching operation control signal.

3. The semiconductor device of claim 2, wherein the switch is configured to, when the switching operation signal is a switch-on signal, switch on in accordance with the switching operation control signal to electrically connect the first coil section and the power generator.

4. The semiconductor device of claim 1, wherein the second clock signal comprises an authentication signal, and the second NFC chip is configured to perform authentication in accordance with the second clock signal.

5. The semiconductor device of claim 1, further comprising a load chip that is electrically connected to the power generator and includes application software.

6. The semiconductor device of claim 5, wherein the first NFC chip and the load chip are configured to receive the electric power from the power generator, when the first clock signal includes a voltage signal.

7. The semiconductor device of claim 5, wherein the first NFC chip and the load chip are electrically connected to each other and configured to transmit and receive data between the first NFC chip and the load tip.

8. The semiconductor device of claim 7, wherein the first NFC chip is further configured to receive data from the load chip and output the data to the reader through the first coil section.

9. The semiconductor device of claim 7, wherein the first NFC chip is configured to receive data from the reader through the first coil section and transmit the data to the load chip.

10-12. -12. (canceled)

13. A semiconductor device comprising:

a first coil section configured to receive a first clock signal from a reader;

a power generator that is electrically connected to the first coil section in accordance with a switching operation of a switch;

a load chip that is electrically connected to the power generator and configured to receive electric power in accordance with the first clock signal, wherein the load chip comprises application software;

a near-field communication (NFC) chip configured to generate a switching operation control signal for controlling the switching operation of the switch, and is electrically connected to the load chip to transmit and receive data; and

a second coil section that is electrically connected to the second NFC chip and configured to receive a second clock signal from the reader.

14. The semiconductor device of claim 13, wherein the NFC chip is configured to, when the second clock signal includes the switching operation signal of the switch, generate the switching operation control signal.

15. The semiconductor device of claim 14, wherein the switch is configured to, when the switching operation signal is a switch-on signal, switch on in accordance with the switching operation control signal to electrically connect the first coil section and the power generator.

16. The semiconductor device of claim 13, wherein the second clock signal comprises an authentication signal and is configured to perform authentication in accordance with the second clock signal.

17. The semiconductor device of claim 13, wherein the load chip is configured to receive the electric power from the power generator, when the first clock signal includes a voltage signal.

18. The semiconductor device of claim 13, wherein the NFC chip is configured to receive data from the load chip and output the data to the reader through the second coil section.

19. The semiconductor device of claim 13, wherein the NFC chip is configured to receive data from the reader through the second coil section and transmit the data to the load chip.

20. (canceled)

21. A semiconductor device comprising:

a first coil section configured to receive a first clock signal from a reader;

a power generator comprising a matching circuit electrically connected to the first coil section in accordance with a switching operation of a switch to perform impedance matching, and a first near-field communication (NFC) chip configured to receive a voltage signal from the matching circuit to generate electric power;

a load chip that is electrically connected to the first NFC chip and configured to receive the electric power in accordance with the first clock signal, wherein the load chip comprises application software;

a second NFC chip configured to generate a switching operation control signal for controlling the switching operation of the switch; and

a second coil section that is electrically connected to the second NFC chip and configured to receive a second clock signal from the reader.

22. The semiconductor device of claim 21, wherein the second NFC chip is further configured to, when the second clock signal includes the switching operation signal of the switch, generate the switching operation control signal.

23. The semiconductor device of claim 22, wherein the switch is configured to, when the switching operation signal is a switch-on signal, switch on in accordance with the switching operation control signal to electrically connect the first coil section and the power generator.

24. The semiconductor device of claim 21, wherein the second clock signal comprises an authentication signal, and the second NFC chip is further configured to perform authentication in accordance with the second clock signal.

25-43. -43. (canceled)