TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME

• US 20170175280A1
• Filed: 07/07/2016
• Published: 06/22/2017
• Est. Priority Date: 12/21/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Wright, Steven L., Liu, Yang, Dang, Bing
• Granted Patent: US 10,638,945 B2
• Time in Patent Office: Days
• CPC Class Codes: A61B 2562/0215 Silver or silver chloride containing
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/0022 Monitoring a patient using a global network, e.g. telephone networks, internet
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: A61B 5/6839 Anchoring means, e.g. barbs
• CPC Class Codes: A61N 1/0492 Patch electrodes A61N1/0412, A61N1/0428 take precedence
• CPC Class Codes: A61N 1/0502 Skin piercing electrodes
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G16H 40/67 for remote operation

Abstract

An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

Claims

1. A method, comprising:

forming a plurality of pits in an array on a first substrate, the pits having a pyramidal shape;

forming a release layer on the first substrate and covering surfaces of the plurality of pits;

forming in the pits probe tips on the first substrate, the probe tips formed from rigid conductive material;

forming a plurality of pillars from rigid conductive material;

electrically and mechanically connecting the plurality of pillars to a second substrate;

electrically and mechanically connecting the plurality of pillars to the plurality of probe tips; and

causing release of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

2. The method of claim 1, wherein:

forming a plurality of pillars from rigid conductive material and electrically and mechanically connecting the plurality of pillars to a first substrate further comprise forming the pillars on corresponding ones of the probe tips, one pillar per probe tip, wherein forming the pillars on corresponding ones of the probe tips also electrically and mechanically connects the plurality of pillars to the first substrate; and

electrically and mechanically connecting the plurality of pillars to a second substrate further comprises electrically and mechanically connecting the plurality of pillars to the second substrate using one of a solder layer or a conductive adhesive to bond the second substrate and the plurality of the pillars, wherein electrically and mechanically connecting the plurality of pillars to the second substrate is performed after forming the plurality of pillars.

3. The method of claim 2, wherein forming the pillars further comprises forming the pillars using lithographic and etching techniques.

4. The method of claim 1, wherein:

forming a plurality of pillars from rigid conductive material and electrically and mechanically connecting the plurality of pillars to a second substrate further comprise forming the pillars on the second substrate, wherein forming the pillars on the second substrate electrically and mechanically connects the plurality of pillars to the second substrate, wherein forming the pillars on the second substrate occurs before electrically and mechanically connecting the plurality of pillars to the plurality of probe tips; and

electrically and mechanically connecting the plurality of pillars to the plurality of probe tips further comprises bonding the plurality of pillars to the plurality of probe tips.

5. The method of claim 4, wherein forming the pillars on the second substrate further comprises forming the pillars on the second substrate using lithography and electrolytic plating techniques.

6. The method of claim 5, wherein bonding the plurality of pillars to the plurality of probe tips further comprises one of using a solder alloy for the bonding or using a conductive epoxy for the bonding.

7. The method of claim 4, wherein bonding the plurality of pillars to the plurality of probe tips further comprises one of using a solder alloy for the bonding or using a conductive epoxy for the bonding.

8. The method of claim 1, wherein forming in the pits probe tips on the first substrate further comprises forming in the pits the probe tips such that a surface of the probe tips aligns with a surface of the first substrate.

9. The method of claim 1, wherein forming in the pits probe tips on the first substrate further comprises forming in the pits the probe tips such that a surface of the probe tips is beneath a surface of the first substrate.

10. The method of claim 9, wherein the pits are partially filled pits that can then form anchor shaped probe tips after release of the probe tips from the first substrate.

11. The method of claim 10, wherein electrically and mechanically connecting the plurality of pillars to the plurality of probe tips further comprises bonding the plurality of pillars to the plurality of probe tips using solder alloy.

12. The method of claim 10, wherein electrically and mechanically connecting the plurality of pillars to the plurality of probe tips further comprises using a conductive epoxy to connect the plurality of pillars to the plurality of probe tips.

13. The method of claim 1, wherein the second substrate comprises a multilayered portion.

14. The method of claim 13, wherein the multilayered portion comprises one or more active circuits.

15. The method of claim 14, wherein the multilayered portion comprises one or more circuit elements on a surface of the multilayered portion opposite a surface of the multilayered portion connected to the plurality of pillars.

16. The method of claim 13, wherein the multilayered portion comprises one or more circuit elements on a surface of the multilayered portion opposite a surface of the multilayered portion connected to the plurality of pillars.

17. The method of claim 13, further comprising forming a plurality of vias in the second substrate, and filling the plurality of vias with breathable material.

18. The method of claim 13, further comprising forming a plurality of vias in the second substrate, and not metalizing the plurality of vias so that the plurality of vias are left unfilled.

19. The method of claim 13, further comprising forming a heat spreader on a surface of the second substrate that is opposite a surface of the second substrate connected to the plurality of pillars.

20. The method of claim 13, wherein the release layer is a seed layer comprising at least one of low-temperature silicon dioxide (SiO₂), sputtered copper (Cu), sputtered gold (Au), sputtered aluminum (Al), and spin-on polycarbonate.