HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
First Claim
1. An inductor for an electronic package comprising:
- a substrate including at least one substrate layer, each substrate layer including a dielectric layer having a first surface and a second surface opposing the first surface;
an aperture in the at least one dielectric layer located from the first surface to the second surface, the aperture including an aperture wall from the first surface to the second surface;
a conductive layer deposited on the first surface, second surface, and the aperture wall; and
at least one coil cut from the conductive layer, the at least one coil located on the aperture wall.
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Accused Products
Abstract
Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.
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Citations
21 Claims
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1. An inductor for an electronic package comprising:
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a substrate including at least one substrate layer, each substrate layer including a dielectric layer having a first surface and a second surface opposing the first surface; an aperture in the at least one dielectric layer located from the first surface to the second surface, the aperture including an aperture wall from the first surface to the second surface; a conductive layer deposited on the first surface, second surface, and the aperture wall; and at least one coil cut from the conductive layer, the at least one coil located on the aperture wall. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making an inductor comprising:
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providing a dielectric layer with a first surface and a second surface; drilling the dielectric layer from the first surface to the second surface to form an aperture in the first and second surfaces, the aperture including an aperture wall from the first surface to the second surface; depositing a conductive layer on the first surface, second surface, and the aperture wall; and cutting a portion of the conductive layer through the entire thickness to form one or more coils on the aperture wall, wherein the coil encircles the aperture wall in at least one revolution from the first surface to the second surface. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. An electronic package including a though-hole inductor comprising:
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a substrate including at least one substrate layer, each substrate layer including a dielectric layer having a first surface and a second surface; an aperture in the dielectric layer located from the first surface to the second surface, the aperture including an aperture wall extended from the first surface to the second surface; a conductive layer deposited on the first surface, second surface, and the aperture wall; and at least one coil cut from the conductive layer, the at least one coil includes a helical shape located on the aperture wall from the first surface to the second surface, wherein the at least one coil is configured to generate an electro-magnetic flux. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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Specification