COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

• US 20170179001A1
• Filed: 12/21/2015
• Published: 06/22/2017
• Est. Priority Date: 12/21/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Brunschwiler, Thomas J., Chainer, Timothy J., Ong, Chin Lee, Parida, Pritish R., Silberman, Joel A., Colgan, Evan G., Schultz, Mark D., Mahankali Sridhar, Arvind Raj, Schlottig, Gerd
• Granted Patent: US 9,941,189 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Claims

1. A structure for cooling an integrated circuit comprising:

an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

2. The structure of claim 1, wherein the at least two expanding channels are arranged in an alternating arrangement, wherein directly adjacent expanding channels have opposing flow directions.

3. The structure of claim 1, wherein the interposer cold plate has a channel inlet on four different sides of the interposer cold plate.

4. The structure of claim 1, wherein the at least two expanding channels are in a counter-flow arrangement, wherein the channel inlet is directly next to the channel outlet of a directly adjacent expanding channel.

5. The structure of claim 1, wherein an average flow direction of adjacent expanding channels are not parallel.

6. The structure of claim 1, wherein the integrated circuit is electrically connected to a substrate.

7. The structure of claim 1, further comprising a backside cold plate, wherein a preheated flow direction is from the backside cold plate to the channel inlet.

8. The structure of claim 1, wherein at least two or more interposer cold plates are separated by at least one electronic device.

9. A structure for cooling a chip comprising:

a single heat transfer structure thermally coupled to the chip, wherein the single heat transfer structure having two or more expanding coolant channels, the expanding coolant channels having a flow direction from a channel inlet to a channel outlet, wherein the flow direction of one of the at least two expanding coolant channels is in a different direction than another one of the at least two expanding coolant channels, and wherein the expanding channels have an inlet width less than an outlet width; and

a manifold providing an inlet pathway to the channel inlet of the at least two expanding coolant channels and an outlet pathway from the channel outlet of the at least two expanding coolant channels.

10. The structure of claim 9, wherein the at least two expanding coolant channels are arranged in an alternating arrangement, wherein directly adjacent expanding coolant channels have opposing flow directions.

11. The structure of claim 9, wherein the single heat transfer structure has a fluid inlet on four different sides.

12. The structure of claim 9, wherein the at least two expanding coolant channels are in a counter-flow arrangement and the flow direction of adjacent expanding coolant channels are in opposing directions.

13. The structure of claim 9, wherein the flow direction of each expanding coolant channel has an average flow direction, and the average flow direction of all adjacent expanding coolant channels are not parallel.

14. The structure of claim 9, wherein the chip is electrically connected to a substrate through a through silicon via (TSV), and wherein the TSV provides structural support for the chip.

15. The structure of claim 9, further comprising a backside cold plate, wherein a preheated flow direction is from the backside cold plate to the channel inlet.

16. The structure of claim 9, wherein at least two or more of the single heat transfer structures are separated by at least one chip.

17. A method of cooling an electronic device comprising:

bonding the electronic device to an interposer cold plate having at least two expanding channels, wherein the at least two expanding channels each include an inlet width less than an outlet width;

generating a first coolant flow direction within a first expanding channel of one of the at least two expanding channels; and

generating a second coolant flow direction within a second expanding channel of another one of the at least two expanding channels, wherein the first coolant flow direction and the second coolant flow direction include different flow directions.

18. The method of claim 17, wherein the electronic device is electrically connected to a substrate with a through silicon via (TSV).

19. The method of claim 18, wherein the TSV provides structural support for the electronic device.

20. The method of claim 17, further comprising a backside cold plate, wherein a preheated flow direction is from the backside cold plate to the channel inlet.