ROUTING FOR THREE-DIMENSIONAL INTEGRATED STRUCTURES

• US 20170179104A1
• Filed: 04/25/2016
• Published: 06/22/2017
• Est. Priority Date: 12/18/2015
• Status: Active Grant

• Current Assignee: STMicroelectronics SAS (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SAS (STMicroelectronics NV)
• Inventors: Ayres, Alexandre, Borot, Bertrand
• Granted Patent: US 10,446,535 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: G06F 30/394 Routing G06F30/396 takes precedence
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/53228 the principal metal being copper
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 27/088 the components being field-effect transistors with insulated gate

Abstract

A three-dimensional integrated structure is formed by a first substrate with first components oriented in a first direction and a second substrate with second components oriented in a second direction. An interconnection level includes electrically conducting tracks that run in a third direction. One of the second direction and third direction forms a non-right and non-zero angle with the first direction. An electrical link formed by at least one of the electrically conducting tracks electrically connected two points of the first or of the second components.

Claims

1. A three-dimensional integrated structure, comprising:

a first substrate including first components oriented in at least a first preferential direction,

a second substrate including second components oriented in at least a second direction, and

at least one interconnection level including electrically conducting tracks running in at least a third direction,

wherein one of the second direction and the third direction forms a non-right and non-zero angle with the first direction such that two points of one of the first component and the second component are connected by a first electrical link comprising at least one of the electrically conducting tracks of the at least one interconnection level.

2. The structure according to claim 1, wherein the non-right and non-zero angle is an angle of 45°

.

3. The structure according to claim 1, comprising:

a first element that includes the first substrate and at least a first interconnection level containing first electrically conducting tracks running in at least a fourth direction that is one of parallel or orthogonal to the first direction, and

a second element that includes at least the second substrate and at least a second interconnection level containing second electrically conducting tracks running in at least a third direction,

wherein the first and second elements are rigidly attached together,

wherein the second direction forms the non-right and non-zero angle with the first direction, and

wherein the third direction is one of parallel or orthogonal to the second direction, and

wherein the two points within the first element are electrically connected by the first electrical link comprising at least one of the second electrically conducting tracks.

4. The structure according to claim 3,

wherein the first electrically conducting tracks run in one of the fourth direction or a fifth direction orthogonal to the fourth direction, and

wherein the second metal tracks run in one of the third direction or a sixth direction orthogonal to the third direction.

5. The structure according to claim 3,

wherein each of the first and second elements comprises an interconnection part comprising several metal levels, and

the first and second interconnection levels comprise at least one metal level of the interconnection part.

6. The structure according to claim 3, wherein the first electrical link comprises vias connecting the two points to the at least a second electrically conducting track.

7. The structure according to claim 3, wherein the first element and the second element are rigidly attached together by electrically conducting pillars.

8. The structure according to claim 3, wherein the first element and the second element are rigidly attached together by a hybrid bonding.

9. The structure according to claim 3, wherein at least one of the first and second elements comprises at least one integrated circuit.

10. The structure according to claim 3, wherein at least two points of the second interconnection level are electrically connected by a second electrical link comprising at least one of the first electrically conducting tracks forming the non-right and non-zero angle with the second electrically conducting tracks of the second interconnection level.

11. The structure according to claim 1, forming a monolithic three-dimensional structure comprising at least the first substrate, the second substrate and the at least one interconnection level.

12. The structure according to claim 11, wherein the first and second directions are parallel and the third direction forms the non-right and non-zero angle with the first and second directions.

13. The structure according to claim 11, wherein the second direction and the third direction are parallel and form the non-right and non-zero angle with the first direction.

14. The structure according to claim 12, wherein the two points of the first substrate are connected by the electrical link comprising one of the electrically conducting track of the at least one interconnection level.

15. The structure according to claim 12, comprising at least a first interconnection level between the first substrate and the second substrate, and wherein the two points of the first interconnection level are connected by an electrical link comprising an electrically conducting track of a second interconnection level running in at least the third direction.

16. A method for fabricating a three-dimensional integrated structure, comprising:

forming first components on a first substrate that are oriented in at least a first preferential direction,

forming second components on a second substrate that are oriented in at least a second direction, and

forming at least one interconnection level comprising electrically conducting tracks running in at least a third direction,

rigidly attaching the first substrate, the second substrate and the at least one interconnection level together such that one of the second direction and the third direction form a non-right and non-zero angle with the first direction, and

connecting two points of the first or second components by a first electrical link comprising at least one of the electrically conducting tracks.

17. The method according to claim 16, wherein the non-right and non-zero angle is an angle of 45°

.

18. The method according to her of claim 16, further comprising:

forming a first element that includes the first substrate and at least a first interconnection level containing first electrically conducting tracks running in at least a fourth direction that is one of parallel or orthogonal to the first direction,

forming a second element that includes the second substrate and at least a second interconnection level containing second electrically conducting tracks running in the at least a third direction (D3),

wherein rigidly attaching comprises rigidly attaching the first and second elements after a rotation of one of the first and second elements with respect to the other of the first and second elements by the non-right and non-zero angle such that the second direction forms the non-right and non-zero angle with the first direction and the third direction is one of parallel or orthogonal to the second direction, and

wherein connecting comprises electrically connecting at least two points of the first element with the first electrical link which comprises at least one of the second electrically conducting tracks.

19. The method according to claim 16, further comprising forming a three-dimensional monolithic integrated structure comprising at least the first substrate, the second substrate and the at least one interconnection level.

20. The method according to claim 19, wherein the first and second directions are parallel and the third direction forms the non-right and non-zero angle with the first and the second directions.

21. The method according to claim 19, wherein the second direction and the third direction are parallel and form with the first direction the non-right and non-zero angle.

22. The method according to claim 20, further comprising forming an electrical link comprising one of the electrically conducting tracks of the interconnection level for connecting two points of the first substrate.

23. The method according to claim 20, further comprising forming at least a first interconnection level between the first substrate and the second substrate and forming an electrical link comprising an electrically conducting track of a second interconnection level running in at least the third direction, the electrical link connecting two points of the first interconnection level.

24. The method according to claim 16, further comprising placing and routing components and electrically conducting tracks taking into account the rotation by the non-right and non-zero angle.