POWER CONVERSION SYSTEM, POWER MODULE, AND SEMICONDUCTOR DEVICE

• US 20170179849A1
• Filed: 12/12/2016
• Published: 06/22/2017
• Est. Priority Date: 12/22/2015
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: YOKOI, Yoshihiko, OJIMA, Yusuke, YAMAZAKI, Koichi
• Granted Patent: US 10,069,439 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/48096 the kinked part being in proximity to the bonding area on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/53 using devices of a triode or transistor type requiring continuous application of a control signal H02M7/4807, H02M7/493 and H02M7/4826 take precedence
• CPC Class Codes: H02M 7/538 in a push-pull configuration H02M7/5375 takes precedence ; with oscillating arrangements H02M7/53832, H02M7/53846
• CPC Class Codes: H02M 7/5387 in a bridge configuration
• CPC Class Codes: H03K 17/0828 in composite switches
• CPC Class Codes: H03K 2217/0027 Measuring means of, e.g. currents through or voltages across the switch
• CPC Class Codes: H03K 2217/0063 High side switches, i.e. the higher potential [DC] or life wire [AC] being directly connected to the switch and not via the load

Abstract

A power conversion system has a first coupling circuit including a wire between a controller and a high-side circuit and a second coupling circuit including a wire between the controller and a low-side circuit. The first coupling circuit has a diode having an anode coupled to a wire from the controller and a cathode coupled to a wire from the high-side circuit.

Claims

1. A power conversion system comprising:

a high-side circuit and a low-side circuit;

a controller communicating with the high-side circuit and the low-side circuit;

a first coupling circuit including a wire between the controller and the high-side circuit; and

a second coupling circuit including a wire between the controller and the low-side circuit,

wherein the high-side circuit includes;

a high-side switch coupled between a first power supply terminal to which a first power supply voltage is supplied using a reference power supply voltage as a reference and a load drive terminal, the high-side switch supplying power to a load via the load drive terminal; and

a high-side driver driving the high-side switch,

wherein the low-side circuit includes;

a low-side switch coupled between a reference power supply terminal to which the reference power supply voltage is supplied and the load drive terminal, the low-side switch supplying power to the load via the load drive terminal; and

a low-side driver driving the low-side switch, and

wherein the first coupling circuit includes a diode having an anode coupled to the wire from the controller and a cathode coupled to the wire from the high-side circuit.

2. The power conversion system according to claim 1,

wherein the high-side circuit includes a first temperature detection diode formed in a semiconductor chip where the high-side switch is formed, the first temperature detection diode detecting a temperature of the high-side switch and having a cathode coupled to the load drive terminal, and

wherein the first coupling circuit includes:

a first diode having a cathode coupled to an anode of the first temperature detection diode;

a second diode having a cathode coupled to the cathode of the first temperature detection diode;

a first current source to which a second power supply voltage lower than the first power supply voltage is supplied, the first current source flowing a forward current to the first temperature detection diode via the first diode;

a second current source to which the second power supply voltage is supplied, the second current source flowing a forward current to the second diode; and

a first differential amplifying circuit detecting a differential voltage between an anode of the first diode and an anode of the second diode and transmitting the detection result to the controller.

3. The power conversion system according to claim 2, wherein the first differential amplifying circuit detects the forward voltage of the first temperature detection diode via the first diode and the second diode in a period in which the high-side switch is in an OFF state and the low-side switch is in an ON state.

4. The power conversion system according to claim 3,

wherein the low-side circuit includes a second temperature detection diode formed in a semiconductor chip where the low-side switch is formed, the second temperature detection diode detecting a temperature of the low-side switch and having a cathode coupled to the reference power supply terminal, and

wherein the second coupling circuit includes:

a third current source flowing a forward current to the second temperature detection diode; and

a second differential amplifying circuit detecting a differential voltage between an anode and the cathode of the second temperature detection diode and transmitting the detection result to the controller.

5. The power conversion system according to claim 1,

wherein the diode transmits a signal from the controller to the high-side circuit in a period in which the high-side switch is in an OFF state and the low-side switch is in an ON state.

6. The power conversion system according to claim 5,

wherein the first coupling circuit includes a pulldown switch coupled between the cathode of the diode and the load drive terminal.

7. The power conversion system according to claim 5, further comprising:

an insulating element converting a voltage level of an output signal of the controller into a voltage level of an input signal of the high-side circuit,

wherein the insulating element transmits an ON/OFF signal of the high-side switch transmitted from the controller to the high-side circuit.

8. The power conversion system according to claim 1,

wherein the diode transmits a signal from the high-side circuit to the controller in a period in which the high-side switch is in an OFF state and the low-side switch is in an ON state.

9. The power conversion system according to claim 8,

wherein the first coupling circuit includes a current source supplied with a second power supply voltage lower than the first power supply voltage and flowing a forward current to the diode.

10. A power module configured as a single package, the power module comprising:

a first power supply terminal to which a first power supply voltage is supplied using a reference power supply voltage as a reference;

a reference power supply terminal to which the reference power supply voltage is supplied;

a load drive terminal;

a high-side circuit and a low-side circuit;

a first terminal transmitting or receiving a signal to or from the high-side circuit;

a second terminal transmitting or receiving a signal to or from the low-side circuit;

a first coupling circuit including a wire between the first terminal and the high-side circuit; and

a second coupling circuit including a wire between the second terminal and the low-side circuit,

wherein the high-side circuit includes;

a high-side transistor coupled between the first power supply terminal and the load drive terminal, the high-side transistor supplying power to a load via the load drive terminal; and

a high-side driver driving the high-side transistor,

wherein the low-side circuit includes;

a low-side transistor coupled between the reference power supply terminal and the load drive terminal, the low-side transistor supplying power to the load via the load drive terminal; and

a low-side driver driving the low-side transistor, and

wherein the first coupling circuit includes a diode having an anode coupled to the wire from the first terminal and a cathode coupled to the wire from the high-side circuit.

11. The power module according to claim 10,

wherein the high-side transistor is formed in a first semiconductor chip,

wherein the low-side transistor is formed in a second semiconductor chip, and

wherein the high-side driver, the low-side driver, and the diode are formed in a third semiconductor chip.

12. The power module according to claim 11,

wherein, in the first semiconductor chip, a first temperature detection diode detecting a temperature of the high-side transistor and having a cathode coupled to the load drive terminal is formed, and

wherein, in the third semiconductor chip,

a first diode having a cathode coupled to an anode of the first temperature detection diode is formed,

a second diode having a cathode coupled to the cathode of the first temperature detection diode is formed,

a first current source flowing a forward current to the first temperature detection diode via the first diode is formed,

a second current source flowing a forward current to the second diode is formed, and

a first differential amplifying circuit detecting a differential voltage between an anode of the first diode and an anode of the second diode and transmitting the detection result to the first terminal is formed.

13. The power module according to claim 12,

wherein, in the second semiconductor chip, a second temperature detection diode detecting a temperature of the low-side transistor and having a cathode coupled to the reference power supply terminal is formed, and

wherein, in the third semiconductor chip,

a third current source flowing a forward current to the second temperature detection diode is formed, and

a second differential amplifying circuit detecting a differential voltage between an anode and the cathode of the second temperature detection diode and transmitting the detection result to the second terminal is formed.

14. The power module according to claim 11,

wherein the diode transmits a signal received at the first terminal to the high-side circuit in a period in which the high-side transistor is in an OFF state and the low-side transistor is in an ON state.

15. The power module according to claim 14,

wherein, in the third semiconductor chip, a pulldown transistor coupled between the cathode of the diode and the load drive terminal is formed.

16. A semiconductor device constituted by a single semiconductor chip, the semiconductor device comprising:

a load drive terminal coupled to a floating voltage;

a reference power supply terminal to which a reference power supply voltage is supplied;

a first temperature detection terminal coupled to a first temperature detection diode provided outside the semiconductor device;

a termination region in a ring shape;

a first region provided inside the termination region, the first region in which a circuit operating at a first power supply voltage using using the floating voltage as a reference is formed;

a second region provided outside the termination region, the second region in which a circuit operating at a second power supply voltage using the reference power supply voltage as a reference is formed;

a high-side driver formed in the first region, the high-side driver driving a high-side transistor provided outside the semiconductor device;

a low-side driver formed in the second region, the low-side driver driving a low-side transistor provided outside the semiconductor device;

a first diode formed in the termination region, the first diode having a cathode coupled to the first temperature detection terminal; and

a first current source formed in the second region, the first current source coupled to an anode of the first diode.

17. The semiconductor device according to claim 16, further comprising:

a second diode formed in the termination region, the second diode having a cathode coupled to the load drive terminal;

a second current source formed in the second region, the second current source coupled to an anode of the second diode; and

a first differential amplifying circuit formed in the second region, the first differential amplifying circuit detecting a differential voltage between the anode of the first diode and the anode of the second diode.

18. The semiconductor device according to claim 17, further comprising:

a second temperature detection terminal coupled to a second temperature detection diode provided outside the semiconductor device;

a second current source formed in the second region, the second current source coupled to the second temperature detection terminal; and

a second differential amplifying circuit detecting a differential voltage between the second temperature detection terminal and the reference power supply terminal.

19. The semiconductor device according to claim 16, further comprising:

a level shift circuit including a transistor formed in the termination region and converting a signal using the reference power supply voltage as a reference into a signal using the floating voltage as a reference to output to the high-side driver.

20. The semiconductor device according to claim 19,

wherein the first diode is constituted by a parasitic diode of the transistor.