THERMAL PRINT HEAD
First Claim
Patent Images
1. A thermal print head comprising:
- a semiconductor substrate;
a resistor layer formed on the semiconductor substrate and having a plurality of heat generating portions arranged in a main scanning direction; and
a wiring layer formed on the semiconductor substrate and included in a conduction path for energizing the plurality of heat generating portions,wherein the conduction path includes the semiconductor substrate.
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Accused Products
Abstract
A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.
11 Citations
40 Claims
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1. A thermal print head comprising:
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a semiconductor substrate; a resistor layer formed on the semiconductor substrate and having a plurality of heat generating portions arranged in a main scanning direction; and a wiring layer formed on the semiconductor substrate and included in a conduction path for energizing the plurality of heat generating portions, wherein the conduction path includes the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification