MATRIX-ADDRESSED DEVICE REPAIR

• US 20170186740A1
• Filed: 02/10/2016
• Published: 06/29/2017
• Est. Priority Date: 12/23/2015
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Bower, Christopher, Meitl, Matthew, Trindade, Antnio Jos Marques
• Granted Patent: US 9,786,646 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 28/00 Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor testing or measuring during manufacture H01L22/00; integration methods H01L21/70; integrated circuits H01L27/00; two-terminal components with a potential-jump or surface barrier H01L29/00; resistors in general H01C; inductors in general H01F; capacitors in general H01G
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10B 43/27 the channels comprising vertical portions, e.g. U-shaped channels

Abstract

A repairable matrix-addressed system includes a system substrate, an array of electrically conductive row lines, and an array of electrically conductive column lines disposed over the system substrate. The row lines extend over the system substrate in a row direction and the column lines extend over the system substrate in a column direction different from the row direction to define an array of non-electrically conductive intersections between the row lines and the column lines. An array of electrically conductive line segments is disposed over the system substrate. The line segments extend over the system substrate substantially parallel to the row direction and have a line segment length that is less than the distance between adjacent column lines. Each line segment is electrically connected to a column line. One or more devices are electrically connected to each row line and to each line segment adjacent to the row line.

Claims

1. A repairable matrix-addressed system, comprising:

a system substrate;

an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines;

an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent column lines, and each line segment electrically connected to a column line; and

one or more devices electrically connected to each row line and to each line segment adjacent to the row line, wherein;

only one device is electrically connected to a first row line and to a first line segment adjacent to the first row line;

at least two or more devices are electrically connected to a second row line and to a second line segment adjacent to the second row line; and

the first row line is different from the second row line, the first line segment is different from the second line segment, or the first row line is different from the second row line and the first line segment is different from the second line segment.

2. The system of claim 1, wherein one or more of the line segments extends to both sides of the column line to which it is electrically connected.

3. The system of claim 1, wherein one or more devices are provided on each side of the column line to which the line segment is electrically connected.

4. The system of claim 1, wherein one or more of the line segments extends substantially to one side of the column line to which it is electrically connected.

5. The system of claim 1, wherein two or more devices are provided on only one side of the column line to which the line segment is electrically connected.

6. The system of claim 1, wherein two devices are electrically connected between one of the line segments and one of the row lines and comprising a cut in the line segment between two of the devices that electrically disconnects one of the devices from the column line.

7. The system of claim 6, wherein one of the two devices is defective.

9. The system of claim 6, wherein the device nearest the column line is defective and comprising an electrical connector electrically connecting the device farthest from the column line to the column line.

10. The system of claim 1, wherein three devices are electrically connected between one of the line segments and one of the row lines and comprising two cuts in the line segment between adjacent pairs of the devices that electrically disconnects two of the devices from the column line.

11. The system of claim 1, wherein the devices comprise a substrate and first and second electrically conductive connection posts protruding from the system substrate, the first posts forming the electrical connection between the device and the row line and the second post forming the electrical connection between the device and the line segment.

12. The system of claim 11, wherein the row line and the line segment are disposed on or in the surface of the system substrate and wherein the first or second connection posts extend onto, into, or through the row line or line segment, respectively.

13. The system of claim 11, wherein the row line and the line segment are disposed on or in the surface of the system substrate and wherein the first or second connection posts are soldered to the row line or the line segment, respectively.

14. The system of claim 11, comprising a non-conductive adhesive adhering the device to the system substrate, to the row line, or to the column line.

22. The system of claim 1, wherein the row lines and the line segments are in a common layer and are equally exposed or are covered with the same layers.

23. The system of claim 1, comprising contact pads on the system substrate electrically connected to the row lines or the line segments and the devices are electrically connected to the contact pads.

45. The system of claim 1, wherein each of the one or more devices comprises:

a controller and one or more light-emitting diodes controlled by the controller.

46. The system of claim 14, wherein the adhesive is at least partially disposed between the first and second posts.

47. The system of claim 1, wherein the devices are bare die, integrated circuits, unpackaged integrated circuits, transducers, light emitters, light-emitting diodes, micro-light-emitting diodes, sensors, capacitive sensors, touch sensors, photo-sensors, electromagnetic radiation sensors, or piezo-electric sensors.

48. The system of claim 1, wherein the devices are modules including one or more electrically or optically connected elements having element substrates and wherein the elements include one or more bare die, integrated circuits, unpackaged integrated circuits, transducers, light emitters, light-emitting diodes, micro-light-emitting diodes, sensors, capacitive sensors, touch sensors, photo-sensors, electromagnetic radiation sensors, or piezo-electric sensors, the module having a module substrate separate from the element substrates.

8. (canceled)

15-21. -21. (canceled)

24. (canceled)

25. A repairable matrix-addressed system, comprising:

a system substrate;

an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines; and

an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent columns, and each line segment electrically connected to a column line;

wherein the line segment extends for a distance over the system substrate to provide one or more empty device locations for each pair of adjacent row lines and line segments.

26. A method of making a repairable matrix-addressed system, comprising:

providing a system substrate;

i) having an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

ii) having an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines; and

iii) having an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent columns, and each line segment electrically connected to a column line; and

after providing the system substrate, disposing one or more devices on the system substrate so that the one or more devices are electrically connected to each row line and to each line segment.

32. The method of claim 26, comprising testing the devices to determine any failed device and adding an additional device between the line segment and row line corresponding to any failed device.

36. The method of claim 26, wherein the one or more devices includes at least one redundant device and comprising testing the devices to determine any failed device and adding an electrical connector to electrically connect the at least one redundant device to the row or column lines.

37. The method of claim 36, comprising cutting the line segment between the failed device and the column line, line segment, or row line to electrically isolate the failed device.

27-31. -31. (canceled)

33-35. -35. (canceled)

38. A repairable matrix-addressed system, comprising:

a system substrate;

an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines;

an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent column lines, and each line segment electrically connected to a column line;

one or more devices electrically connected to each row line and to each line segment adjacent to the row line;

wherein two devices are electrically connected between one of the line segments and one of the row lines and comprising a cut in the line segment between two of the devices that electrically disconnects one of the devices from the column line; and

wherein the device nearest the column line is defective and comprising an electrical connector electrically connecting the device farthest from the column line to the column line.

39. A repairable matrix-addressed system, comprising:

a system substrate;

an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines;

an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent column lines, and each line segment electrically connected to a column line;

one or more devices electrically connected to each row line and to each line segment adjacent to the row line; and

wherein the devices comprise a substrate and first and second electrically conductive connection posts protruding from the system substrate, the first posts forming the electrical connection between the device and the row line and the second post forming the electrical connection between the device and the line segment.

40. The system of claim 39, wherein the row line and the line segment are disposed on or in the surface of the system substrate and wherein the first or second connection posts extend onto, into, or through the row line or line segment, respectively.

41. The system of claim 39, wherein the row line and the line segment are disposed on or in the surface of the system substrate and wherein the first or second connection posts are soldered to the row line or the line segment, respectively.

42. The system of claim 39, comprising a non-conductive adhesive adhering the device to the system substrate, to the row line, or to the column line.

43. A repairable matrix-addressed system, comprising:

a system substrate;

an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines;

an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent column lines, and each line segment electrically connected to a column line;

one or more devices electrically connected to each row line and to each line segment adjacent to the row line; and

contact pads on the system substrate electrically connected to the row lines or the line segments and the devices are electrically connected to the contact pads.

44. A method of making a repairable matrix-addressed system, comprising:

providing a system substrate;

i) having an array of electrically conductive row lines disposed over the system substrate, the row lines extending over the system substrate in a row direction;

ii) having an array of electrically conductive column lines disposed over the system substrate, the column lines extending over the system substrate in a column direction different from the row direction defining an array of non-electrically conductive intersections between the row lines and the column lines; and

iii) having an array of electrically conductive line segments disposed over the system substrate, the line segments extending over the system substrate substantially parallel to the row direction, the line segments having a line segment length that is less than the distance between adjacent columns, and each line segment electrically connected to a column line;

disposing one or more devices on the system substrate so that the one or more devices are electrically connected to each row line and to each line segment; and

testing the devices to determine any failed device and adding an additional device between the line segment and row line corresponding to any failed device.