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OFFSET CONTROL FOR ASSEMBLING AN ELECTRONIC DEVICE HOUSING

  • US 20170196112A1
  • Filed: 03/22/2017
  • Published: 07/06/2017
  • Est. Priority Date: 02/02/2010
  • Status: Active Grant
First Claim
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1. A method for assembling a device housing of an electronic device, said method comprising:

  • providing an outer glass member for the device housing;

    providing a protective side structural member having a receptive plane that is to receive the outer glass member;

    applying a liquid adhesive to a portion of the outer glass member and/or a portion of the protective side structural member;

    positioning the outer glass member adjacent to the receptive plane of the protective side structural member;

    applying a first force to push the outer glass member against a planar reference surface;

    applying a second force to push the protective side structural member against the planar reference surface, wherein the second force is independently applied from the first force;

    curing the liquid adhesive into a solid bonding material that bonds together the outer glass member and the protective side structural member, thereby assembling the outer glass member with the protective side structural member; and

    subsequently removing the first force and the second force.

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