ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND PHYSICAL-QUANTITY SENSOR
First Claim
Patent Images
1. An electronic device comprising:
- a package; and
a functional element,wherein a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.
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Accused Products
Abstract
An electronic device includes a package; and a functional element, in which a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.
16 Citations
16 Claims
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1. An electronic device comprising:
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a package; and a functional element, wherein a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 13, 14)
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9. A method for manufacturing an electronic device comprising:
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applying an adhesive on a side surface of a functional element; fixing the side surface of the functional element to a side surface of a package on an inner side thereof; curing the adhesive; fixing an IC to the functional element; electrically connecting the functional element and the IC; electrically connecting the package and the IC; and mounting and sealing a lid member on the package.
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10. A physical-quantity sensor comprising:
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a first substrate; a second substrate fixed on the first substrate via the adhesive; and a sensor element disposed on the second substrate, wherein the sensor element is provided with a fixed electrode portion fixed to the second substrate, and a support that fixes a movable electrode portion to be movable and is fixed to the second substrate, and wherein the adhesive is disposed on one side of an outer peripheral portion of the second substrate so as not to overlap the fixed electrode portion and the support when the second substrate is viewed in a plan view. - View Dependent Claims (11, 12, 15, 16)
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Specification