Fabrication and Operation of Multi-Function Flexible Radiation Detection Systems

• US 20170200762A1
• Filed: 01/12/2017
• Published: 07/13/2017
• Est. Priority Date: 01/13/2016
• Status: Active Grant

• Current Assignee: mPower Technology, Inc.
• Original Assignee: mPower Technology, Inc.
• Inventors: Okandan, Murat, Koskelo, Markku Juhani
• Granted Patent: US 10,483,316 B2
• Time in Patent Office: Days
• CPC Class Codes: G01T 1/20181 Stacked detectors, e.g. for measuring energy and positional information using a combination of different types of scintillation detectors, e.g. phoswich detectors, G01T1/2008
• CPC Class Codes: G01T 1/24 with semiconductor detectors
• CPC Class Codes: G01T 1/241 Electrode arrangements, e.g. continuous or parallel strips or the like constructional or manufacturing details H01L31/00
• CPC Class Codes: G01T 3/08 with semiconductor detectors
• CPC Class Codes: G01T 7/00 Details of radiation-measuring instruments
• CPC Class Codes: H01L 27/14659 Direct radiation imagers structures

Abstract

Curved, flexible arrays of radiation detectors are formed by using standard silicon semiconductor processing materials and techniques and additional functionalization through integration of conversion and shielding materials. The resulting flexible arrays can be handled, integrated, further functionalized and deployed for a wide variety of applications where conventional sensors do not provide the desired functionality, form factors and/or reliability. The arrays can be stacked and include multiple types and thicknesses of conversion layers, enabling the detector to simultaneously detect multiple radiation types, and perform complex, simultaneous functions such as energy discrimination, spectroscopy, directionality detection, and particle trajectory tracking of incident radiation.

Claims

1. A radiation detector comprising:

an array of microscale semiconductor sensors disposed on a flexible substrate; and

at least one type of conversion layer;

wherein said conversion layer is sufficiently thin to enable the detector to flex in accordance with said substrate.

2. The radiation detector of claim 1 wherein said conversion layer is disposed on top of each sensor, on one or more sides of each sensor, or both on top and on one or more sides of each sensor.

3. The radiation detector of claim 1 wherein said sensors comprise solar cells, photodiodes, or one or more p-n junctions.

4. The radiation detector of claim 3 wherein said sensors detect photons or electrons produced by said conversion layer when said conversion layer is illuminated by incident radiation.

5. The radiation detector of claim 1 formable into an arbitrary three dimensional shape.

6. The radiation detector of claim 5 further comprising a rigid backer to maintain said shape of said radiation detector.

7. The radiation detector of claim 1 comprising different types and/or thicknesses of conversion layers.

8. The radiation detector of claim 7 for simultaneously detecting two or more types of radiation.

9. The radiation detector of claim 8 wherein said types of radiation are selected from the group consisting of x-rays, gamma rays, microwaves, neutrons, alpha particles, beta particles, and cosmic radiation.

10. The radiation detector of claim 7 for performing energy discrimination and/or spectroscopy of incident radiation.

11. The radiation detector of claim 1 comprising multiple stacked substrates and sensor arrays.

12. The radiation detector of claim 11 for detecting directionality and/or tracking particle trajectories of incident radiation.

13. The radiation detector of claim 11 wherein said detector generates multiple signals for each incident radiation particle or photon.

14. The radiation detector of claim 1 comprising integrated circuitry for performing one or more functions on signals produced by said detectors, said functions selected from the group consisting of pre-conditioning, amplification, filtering, and processing.

15. The radiation detector of claim 14 wherein said integrated circuitry is embedded with each said sensor.

16. The radiation detector of claim 15 wherein said one or more functions are performed without said signals having to first be transmitted to an edge circuit.

17. The radiation detector of claim 14 wherein said integrated circuitry is manufactured in the same process as a process used to manufacture said sensors.

18. The radiation detector of claim 14 wherein said integrated circuitry is added to said detector after said sensors are manufactured.

19. The radiation detector of claim 1 wherein flexing of said conversion layer in accordance with flexing of said substrate does not result in substantial loss of functionality.