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LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES

  • US 20170200853A1
  • Filed: 02/21/2017
  • Published: 07/13/2017
  • Est. Priority Date: 10/21/2011
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a first wafer comprising a plurality of light emitting semiconductor devices grown on a growth substrate;

    providing a second wafer comprising a first surface, a second surface opposite the first surface, and a plurality of slots formed on the second surface;

    aligning the plurality of slots with boundaries between light emitting semiconductor devices on the first wafer; and

    bonding the first surface of the second wafer to the first wafer.

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