Electrical Feedthrough Assembly

• US 20170203108A1
• Filed: 04/03/2017
• Published: 07/20/2017
• Est. Priority Date: 05/12/2010
• Status: Abandoned Application

• Current Assignee: Advanced Bionics AG (Sonova Holding AG)
• Original Assignee: Advanced Bionics AG (Sonova Holding AG)
• Inventors: Palmer, Logan P., Koester, Kurt J., Stuursma, David, Thenuwara, Chuladatta, Beerling, Timothy, Downing, Mark B.
• Application Number:
  US15/477,621
• Publication Number:
  US 20170203108A1
• Time in Patent Office: Days
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/36038 Cochlear stimulation
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 23/045 the other leads having an insulating passage through the base
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/09 of a plurality of bonding areas
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/3512 Cracking

Abstract

A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.

Claims

1. A feedthrough comprising:

a body having a first side and a second side separated by a thickness;

a first conductive pad on the first side;

a second conductive pad on the second side; and

a plurality of conductive vias electrically connecting the first conductive pad and the second conductive pad.

2. The feedthrough of claim 1, wherein the first conductive pad and second conductive pad comprise different materials.

3. The feedthrough of claim 1, wherein the first conductive pad and the second conductive pad have a common geometry.

4. The feed through of claim 3, wherein a center point of the first conductive pad and a center point of the second conductive pad could be connected by a straight line perpendicular to the first and second conductive pads.

5. The feedthrough of claim 1, wherein the vias have a common geometry.

6. The feedthrough of claim 1, wherein the vias are equidistant from each other.

7. The feedthrough of claim 1, wherein a center of a cross-section of each via is equidistant from a center-point of the first conductive pad.

8. The feedthrough of claim 1, wherein the plurality of vias comprises three vias.

9. The feedthrough of claim 1, wherein each via has a separate contact with the first conductive pad.

10. The feedthrough of claim 1, wherein each via does not electrically communicate with any other via except through the first and second conductive pads.

11. The feedthrough of claim 1, wherein a projection of each via onto the first side remains within a perimeter of the first conductive pad.

12. The feedthrough of claim 1, wherein each via is straight and extends perpendicular to the first and second conductive pads.

13. The feedthrough of claim 1, further comprising an array of vies, each via in the array of vias extending between a unique conductive pad on the first surface and a unique conductive pad on the second surface.

14. The feedthrough of claim 1, further comprising a third conductive pad on the first side and a fourth conductive pad on the second side, where the third and fourth conductive pads are connected by a second plurality of vies.

15. The feedthrough of claim 14, wherein:

the first and second conductive pads and the plurality of vias form a first structure,

the third and fourth conductive pads and the second plurality of vias form a second structure, and

the first and second structure have a common geometry.

16. The feedthrough of claim 15, further comprising an array of vies, each via in the array of vies extending between a unique conductive pad on the first surface and a unique conductive pad on the second surface

17. A method of forming a ceramic feedthrough for a hermetically sealed case, the method comprising:

forming multiple stacked layers comprising green sheet material and metal, wherein the metal forms a plurality of vias through the stacked layers;

co-firing the multiple stacked layers; and

forming a first conductive pad on a top surface of the feedthrough, wherein the first conductive pad is in electrical communication with a second conductive pad on a bottom surface of the feedthrough, the first and second conductive pads electrically connected by the plurality of vias.

18. The method of claim 17, further comprising:

brazing the ceramic feedthrough using a braze material containing ceramic particulate.

19. A device comprising:

a hermetically sealed case with electronic circuitry housed therein, wherein one surface of the hermetically sealed case comprises;

a metallic plate,

a co-fired ceramic electrical feedthrough hermetically joined to the metallic plate, the feedthrough comprising;

a conductive via passing from a first conductive pad on a first side of the feedthrough to a second conductive pad on a second side of the feedthrough; and

a shield of conductive material shielding the via, the shield not in electrical contact with the via; and

a circuit electrically coupled to the via of the feedthrough.

20. The device of claim 19, wherein the shield comprises an electrical contact on the first side of the feedthrough.