MICROCHIP MANUFACTURED WITH THERMOCOMPRESSION

• US 20170203296A1
• Filed: 02/28/2017
• Published: 07/20/2017
• Est. Priority Date: 07/20/2011
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: YUKUMOTO, Tomomi, AKIYAMA, Shoji, YAMASAKI, Takeshi, AKIYAMA, Yuji
• Granted Patent: US 10,414,118 B2
• Time in Patent Office: Days
• CPC Class Codes: B01L 2200/0636 Focussing flows, e.g. to laminate flows
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0654 Lenses; Optical fibres
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0838 Capillaries
• CPC Class Codes: B01L 2300/0877 Flow chambers
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 3/266 characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: G01N 2021/513 Cuvettes for scattering measurements
• CPC Class Codes: G01N 2021/6482 Sample cells, cuvettes
• CPC Class Codes: G01N 21/51 inside a container, e.g. in an ampoule G01N21/53 takes precedence
• CPC Class Codes: G01N 21/645 Specially adapted constructive features of fluorimeters
• CPC Class Codes: G01N 2201/06113 : Coherent sources; lasers
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet

Abstract

There is provided a microchip including at least two substrates each comprising a thermoplastic resin, and at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin, the at least one member including at least one engagement end including a protrusion extending between the at least two substrates, wherein the at least one member is fixed to the at least two substrates by the protrusion being held between the at least two substrates by at least one wall surface that is thermally deformed by thermocompression.

Claims

10. A microchip comprising:

at least two substrates each comprising a thermoplastic resin;

a space provided in at least one of the substrates; and

at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space,

wherein the at least one member is fixed within the space by at least one wall surface that is thermally deformed by thermocompression.

1. A microchip comprising:

at least two substrates each comprising a thermoplastic resin; and

at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin, the at least one member including at least one engagement end including a protrusion extending between the at least two substrates,

wherein the at least one member is fixed to the at least two substrates by the protrusion being held between the at least two substrates by at least one wall surface that is thermally deformed by thermocompression.

2. The microchip according to claim 1, wherein at least one of the at least two substrates includes the at least one wall surface.

3. The microchip according to claim 1, which includes a flow path formed between the at least two substrates.

4. The microchip according to claim 3, wherein at least a portion of the flow path is formed by the at least one member.

5. The microchip according to claim 3, wherein the at least one member includes a light irradiated portion where light can be irradiated onto one of a liquid that flows through the flow path and a sample contained in the liquid.

6. The microchip according to claim 1, wherein the at least one member comprises a material having a higher optical transparency than that of the thermoplastic resin.

7. The microchip according to claim 1, wherein each of a first end and a second end of the at least one member includes an engagement end including a protrusion, and wherein the at least one member is fixed to the at least two substrates by both of the protrusions being held between the at least two substrates by at least one wall surface that is thermally deformed by thermocompression.

8. The microchip according to claim 1, wherein the member comprises a glass material.

9. The microchip according to claim 1, wherein the at least two substrates overlap the protrusion at a recess formed between the at least two substrates.

11. The microchip according to claim 10, which includes a flow path formed between the at least two substrates.

12. The microchip according to claim 11, wherein at least a portion of the flow path is formed by the at least one member.

13. The microchip according to claim 12, wherein the at least one member includes a light irradiated portion where light is irradiated onto the portion of the flow path formed by the at least one member.

14. The microchip according to claim 10, wherein the at least one member includes at least one engagement end including a protrusion extending into a recess formed between the at least two substrates, and wherein the thermal deformation occurs around the protrusion.

15. The microchip according to claim 10, wherein at least one of the at least two substrates includes the at least one wall surface.

13-1. The microchip according to claim 11, wherein the space separates a first portion of the flow path from a second portion of the flow path, and wherein the at least one member fluidly connects the first portion of the flow path with the second portion of the flow path.

16. A microchip comprising:

at least two substrates each comprising a thermoplastic resin; and

at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin; and

a flow path formed between the at least two substrates such that at least a portion of the flow path is formed by the at least one member,

wherein the at least one member is fixed to the at least two substrates by at least one wall surface that is thermally deformed by thermocompression.

17. The microchip according to claim 16, wherein a first portion of the flow path is formed between the at least two substrates, and wherein a second portion of the flow path is formed by the at least one member.

18. The microchip according to claim 16, wherein the at least one member fluidly connects a first portion of the flow path to a second portion of the flow path.

19. The microchip according to claim 18, wherein the first portion of the flow path and the second portion of the flow path are formed between the at least two substrates and separated by a space in at least one of the at least two substrates.

20. The microchip according to claim 19, wherein the at least one member is located within the space to fluidly connect the first portion of the flow path to the second portion of the flow path.