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MICROCHIP MANUFACTURED WITH THERMOCOMPRESSION

  • US 20170203296A1
  • Filed: 02/28/2017
  • Published: 07/20/2017
  • Est. Priority Date: 07/20/2011
  • Status: Active Grant
First Claim
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10. A microchip comprising:

  • at least two substrates each comprising a thermoplastic resin;

    a space provided in at least one of the substrates; and

    at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space,wherein the at least one member is fixed within the space by at least one wall surface that is thermally deformed by thermocompression.

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