3D PHOTONIC INTEGRATION WITH LIGHT COUPLING ELEMENTS

• US 20170207600A1
• Filed: 07/14/2015
• Published: 07/20/2017
• Est. Priority Date: 07/14/2014
• Status: Abandoned Application

• Current Assignee: Biond Photonics Inc.
• Original Assignee: Biond Photonics Inc.
• Inventors: Klamkin, Jonathan, Ristic, Sasa
• Application Number:
  US15/326,452
• Publication Number:
  US 20170207600A1
• Time in Patent Office: Days
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12078 Gallium arsenide or alloys (GaAs, GaAlAs, GaAsP, GaInAs)
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 2006/12121 Laser
• CPC Class Codes: G02B 2006/12147 Coupler
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/124 Geodesic lenses or integrated gratings
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/14 Mode converters
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: H01S 3/107 using electro-optic devices, e.g. exhibiting Pockels or Kerr effect H01S3/1061, H01S3/1063, H01S3/1065 take precedence
• CPC Class Codes: H01S 5/0085 for modulating the output, i.e. the laser beam is modulated outside the laser cavity
• CPC Class Codes: H01S 5/021 Silicon based substrates
• CPC Class Codes: H01S 5/02255 using beam deflecting elements
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
• CPC Class Codes: H01S 5/026 Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers stabilisation of output H01S5/06
• CPC Class Codes: H01S 5/0287 Facet reflectivity
• CPC Class Codes: H01S 5/1032 Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
• CPC Class Codes: H01S 5/1085 : Oblique facets
• CPC Class Codes: H01S 5/141 : using a wavelength selective device, e.g. a grating or etalon H01S5/146 takes precedence
• CPC Class Codes: H01S 5/142 : which comprises an additional resonator
• CPC Class Codes: H01S 5/4062 : with an external cavity or using internal filters, e.g. Talbot filters

Abstract

Methods for realizing integrated lasers and photonic integrated circuits on complimentary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic chips, potentially containing integrated electronics, are disclosed. The integration techniques rely on light coupling with integrated light coupling elements such as turning mirrors, lenses, and surface grating couplers. Light is coupled from between two or more substrates using the light coupling elements. The technique can realize integrated lasers on Si where a gain flip chip (the second substrate) is bonded to a Si chip (the first substrate) and light is coupled between a waveguide in the gain flip chip to a Si waveguide by way of a turning mirror or grating coupler in the flip chip and a grating coupler in the Si chip. Integrated lenses and other elements such as spot-size converters can also be incorporated to alter the mode from the gain flip chip to enhance the coupling efficiency to the Si chip. The light coupling integration technique also allows for the integration of other components such as modulators, amplifiers, and photodetectors. These components can be waveguide-based or non-waveguide based, that is to say, surface emitting or illuminating.

Claims

1. A method, comprising:

selecting a first optical substrate and a second optical substrate, wherein at least the first substrate includes a planar waveguide;

selecting a beam direction transition that is optically coupled to the planar waveguide, the beam direction transition situated so as to define a beam propagation axis that includes a portion corresponding to an axis of the planar waveguide and a portion that extends from the beam direction transition through a major surface of a first optical substrate; and

securing the second optical substrate to the first optical substrate so as to optically couple the beam propagation axis of the first optical substrate and the second optical substrate.

2. The method of claim 1, wherein the first and second optical substrates are secured by direct molecular bonding, adhesive bonding, bonding with an interfacial layer, flip-chip metal thermocompression bonding, or flip-chip solder bonding.

3. The method of claim 2, wherein the beam direction transition includes at least one of a grating coupler, an out-of-plane total internal reflection turning mirror, a lens, a prism, or a combination thereof.

4. The method of claim 3, wherein the second optical substrate includes a beam direction transition situated to optically couple the beam propagation axis into a planar waveguide in the second optical substrate.

5. The method of claim 4, wherein the beam direction transitions of the first and second optical substrates are monolithic to the first and second optical substrates, respectively.

6. The method of claim 3, further comprising at least one optical filter, optical coating, optical isolator, polarizer, or lens optically coupled to the beam propagation axis of the first substrate.

7. The method of claim 5, wherein the at least one optical filter, optical coating, optical isolator, polarizer, or lens optically coupled to the beam propagation axis of the first substrate is defined in the first optical substrate or the second optical substrate.

8. A photonic device, comprising:

at least one horizontal waveguide defined in a substrate;

at least one spot size converter defined in the substrate and optically coupled to the at least one horizontal waveguide, the spot size converter situated to receive an optical beam propagating in the horizontal waveguide or to direct an optical beam to the horizontal waveguide, the spot size convertor configured to produce a spot size converted optical beam based on a horizontal waveguide mode field diameter; and

at least one beam transition defined in the substrate and coupled to the at least one spot size converter and situated to receive or transmit the spot size converted optical beam.

9. The photonic device of claim 8, wherein the horizontal waveguide is at least one of a ridge, rib, strip, stripe, buried ridge, buried stripe, buried channel, photonic crystal, or slot waveguide.

10. The photonic device of claim 9, wherein said spot size converter transition element is selected from the group consisting of:

a lateral down-tapered buried waveguide, a lateral up-tapered buried waveguide, a single lateral taper transition from a ridge waveguide to a grating coupler-matched waveguide, a multi-section taper transition from a ridge waveguide to a grating coupler-matched waveguide, a dual lateral overlapping buried waveguide taper, a dual lateral overlapping ridge waveguide taper, a nested taper transition from a ridge waveguide to a grating coupler-matched waveguide, a vertical down-tapered buried waveguide, a vertical down-tapered ridge waveguide, a vertical overlapping ridge waveguide taper, a vertical overlapping waveguide taper transition from a buried waveguide to a grating coupler-matched waveguide, a vertical overlapping waveguide taper transition from a ridge waveguide to a grating coupler-matched waveguide, a combined lateral and vertical ridge waveguide taper, a 2-D overlapping waveguide transition from a buried waveguide to a grating coupler-matched waveguide, and an overlapping waveguide taper transition with two sections from a ridge waveguide to a grating coupler-matched waveguide.

11. The photonic device of claim 10, wherein the spot size converter is situated to alter at least one of a beam size, beam shape, and beam divergence of a beam exiting or entering the optical waveguide as the beam propagates to or from the beam direction transition, and further wherein the beam direction transition alters a beam propagation direction from a horizontal direction to an out-of-plane direction.

12. The photonic device of claim 11, wherein the beam direction transition is selected from the group consisting of a total internal reflection mirror, turning mirror, curved total internal reflection mirror, grating, grating coupler, grating-assisted coupler, prism, or a combination of more than one of such elements.

13. The photonic device of claim 12, wherein the beam direction transition is situated so as to redirect a light path from horizontal to vertical with respect to the plane of the substrate.

15. The photonic circuit of claim 13, wherein at least one of the photonic devices is a surface emitting photonic device.

16. The photonic circuit of claim 15, wherein at least one of the at least two photonic devices is said surface emitting device, comprising at least one horizontal waveguide and at least one spot size converter and at least one beam direction transition optically coupled to the spot size converter.

17. The photonic circuit of claim 15, wherein at least one of the photonic devices is optically coupled so as to receive an optical beam from the surface emitting device.

18. The photonic circuit of claim 15, wherein at least one of the at least two photonic devices includes a horizontal waveguide optically coupled to at least one spot size converter, and at least one beam direction transition optically coupled to the surface emitting device.

19. The photonic circuit of claim 15, wherein one of the at least two photonic devices is secured to a third photonic device so as to couple an optical beam between the first and third photonic devices.

14. A photonic circuit, comprising:

at least two photonic devices, wherein at least one of the photonic devices includes a planar waveguide, and the at least two or more photonic devices are secured to each other.

20-187. -187. (canceled)