DIAMOND NITROGEN VACANCY SENSOR WITH CIRCUITRY ON DIAMOND

• US 20170212182A1
• Filed: 01/21/2016
• Published: 07/27/2017
• Est. Priority Date: 01/21/2016
• Status: Active Grant

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Hahn, Joseph W., Lew, Wilbur, Huynh, Duc
• Granted Patent: US 9,823,313 B2
• Time in Patent Office: Days
• CPC Class Codes: G01R 33/0052 Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips devices based on galvano-magnetic effect or the like H10N50/85
• CPC Class Codes: G01R 33/032 using magneto-optic devices, e.g. Faraday or Cotton-Mouton effect
• CPC Class Codes: G01R 33/60 using electron paramagnetic resonance G01R33/24, G01R33/62 take precedence

Abstract

A magnetic sensor assembly includes a base substrate and a material assembly. The material assembly is formed on the base substrate. The material assembly includes an assembly substrate. A magneto-optical defect center material having a plurality of magneto-optical defect centers is formed on the assembly substrate. A radio frequency (RF) excitation source is formed on the magneto-optical defect center material.

Claims

1. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

a radio frequency (RF) excitation source formed on the NV diamond material, wherein the RF excitation source has a spiral shape.

2. The magnetic sensor assembly of claim 1, wherein the RF excitation source comprises a first RF excitation source on a first side of the NV diamond material, and a second RF excitation source on a second side of the NV diamond material opposite to the first side.

3. The magnetic sensor assembly of claim 1, wherein RF excitation source is formed on a first side the NV diamond material, and a size of the RF excitation source in a plane of the first side is greater than a size of the first side of the NV diamond material.

4. The magnetic sensor assembly of claim 1, further comprising:

an assembly substrate; and

one or more optical detectors formed in a detector region in a plane on the assembly substrate, wherein a size of the RF excitation source in the plane is greater than a size of the detector region.

5. The magnetic sensor assembly of claim 4, wherein RF excitation source is formed on a first side the NV diamond material, and a size of the RF excitation source in a plane of the first side is greater than a size of the first side of the NV diamond material.

6. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

a radio frequency (RF) excitation source formed on the NV diamond material.

7. The magnetic sensor assembly of claim 6, wherein the RF excitation source is in the form of a coil.

8. The magnetic sensor assembly of claim 6, wherein the RF excitation source comprises:

a seed layer formed on a surface of the NV diamond material; and

a film metallization layer formed on the seed layer.

9. The magnetic assembly of claim 6, wherein the film metallization layer is formed of copper.

10. The magnetic sensor assembly of claim 6, where the diamond assembly further comprises an RF connector connected to the excitation source, the RF connector configured to connect to a power source and a controller.

11. The magnetic sensor assembly of claim 6, wherein the base substrate comprises a printed circuit board (PCB).

12. A magnetic sensor assembly, comprising:

a base substrate; and

a material assembly, formed on the base substrate, and comprising;

an assembly substrate;

magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate; and

a radio frequency (RF) excitation source formed on the magneto-optical defect center material.

13. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

an electromagnetic excitation source formed on the NV diamond material or on the assembly substrate; and

power/logic circuits formed on the base substrate and electrically connected to the electromagnetic excitation source to provide control of the electromagnetic excitation source.

14. The magnetic sensor assembly of claim 13, wherein electromagnetic excitation source is an optical excitation source.

15. The magnetic sensor assembly of claim 13, wherein the base substrate comprises a printed circuit board (PCB).

16. The magnetic sensor assembly of claim 13, further comprising a power/logic connector electrically connected to the power/logic circuits and comprising a plurality of connectors configured to connect to an external power source and controller.

17. The magnetic sensor assembly of claim 13, wherein at least some of the power/logic circuits are mounted on a same top surface of the base substrate that the diamond assembly is mounted on.

18. The magnetic sensor assembly of claim 13, wherein at least some of the power/logic circuits are mounted on a bottom surface of the base substrate opposite to a surface of the base substrate that the diamond assembly is mounted on.

19. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

an optical excitation source formed on the NV diamond material.

20. The magnetic sensor assembly of claim 19, wherein the optical excitation source is one of a laser diode or a light emitting diode.

21. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

an optical detector formed on the assembly substrate.

22. The magnetic sensor assembly of claim 21, wherein the optical detector is a photodiode.

23. The magnetic sensor assembly of claim 21, wherein the base substrate comprises a printed circuit board (PCB).

24. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate;

an optical excitation source formed on the assembly substrate; and

an optical detector formed on the assembly substrate.

25. The magnetic sensor assembly of claim 24, wherein the optical detector is a photodiode.

26. The magnetic sensor assembly of claim 24, wherein the optical excitation source is one of a laser diode or a light emitting diode.

27. A magnetic sensor assembly, comprising:

a base substrate; and

a material assembly, formed on the base substrate, and comprising;

an assembly substrate;

magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate;

an optical excitation source formed on the assembly substrate; and

an optical detector formed on the assembly substrate.

28. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate;

a plurality of optical excitation sources formed on the assembly substrate; and

a plurality of optical detectors formed on the assembly substrate.

29. The magnetic sensor assembly of claim 28, wherein the optical excitation sources and the optical detectors are arranged in an alternating fashion on the assembly substrate.

30. The magnetic sensor assembly of claim 29, wherein the optical excitation sources and the optical detectors are arranged in a checkerboard fashion.

31. The magnetic sensor assembly of claim 28, wherein the optical excitation sources are one of laser diodes or light emitting diodes.

32. The magnetic sensor assembly of claim 28, wherein the optical detectors are photodiodes.

33. A magnetic sensor assembly, comprising:

a base substrate; and

a diamond assembly, formed on the base substrate, and comprising;

an assembly substrate;

nitrogen vacancy (NV) diamond material comprising a plurality of NV centers, and formed on the assembly substrate; and

a plurality of optical excitation sources formed on a top surface of the assembly substrate, wherein the assembly substrate has a plurality of connection pads on a bottom surface of the assembly substrate contacting corresponding conducting through connections extending through the assembly substrate and electrically connected to plurality of the optical excitation sources.

34. The magnetic sensor assembly of claim 33, further comprising a radio frequency (RF) excitation source formed on the NV diamond material.

35. A method of forming a magnetic sensor assembly comprising:

forming a base substrate;

forming an assembly substrate on base substrate;

forming a nitrogen vacancy (NV) diamond material comprising a plurality of NV centers on the assembly substrate; and

forming a radio frequency (RF) excitation source on the NV diamond material.

36. The method of forming a magnetic sensor assembly according to claim 35, wherein the forming a RF excitation source forms the RF excitation source in the form of a coil.

37. The method of forming a magnetic sensor assembly according to claim 35, wherein the forming a RF excitation source comprises:

forming a seed layer on a surface of the NV diamond material;

depositing a film metallization layer formed on the seed layer; and

patterning the seed layer and the film metallization to form the RF excitation source in a spiral shape.

38. The method of forming a magnetic sensor assembly according to claim 37, wherein the film metallization layer is formed of copper.

39. A method of forming a magnetic sensor assembly comprising:

forming a base substrate;

forming an assembly substrate on base substrate;

forming a plurality of optical excitation sources on the assembly substrate; and

forming a nitrogen vacancy (NV) diamond material comprising a plurality of NV centers on the assembly substrate.

40. A magnetic sensor assembly, comprising:

a base substrate; and

a material assembly, formed on the base substrate, and comprising;

an assembly substrate;

magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate; and

a radio frequency (RF) means, for providing an RF field, formed on the magneto-optical defect center material.

41. A magnetic sensor assembly, comprising:

a base substrate; and

a material assembly, formed on the base substrate, and comprising;

an assembly substrate;

magneto-optical defect center material comprising a plurality of magneto-optical defect centers, and formed on the assembly substrate;

an optical excitation means, for providing optical excitation, formed on the assembly substrate; and

a detector means, for detecting optical radiation, formed on the assembly substrate.