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SEMICONDUCTOR DEVICE

  • US 20170213779A1
  • Filed: 08/08/2016
  • Published: 07/27/2017
  • Est. Priority Date: 01/26/2016
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a coolant jacket comprising a passage through which a coolant flows inside said coolant jacket;

    a first power module mounted on a first-surface member of said coolant jacket; and

    a second power module mounted on a second-surface member of said coolant jacket, said second-surface member facing said first-surface member,wherein said coolant jacket comprises;

    a first fin in contact with said first-surface member in said passage;

    a second fin in contact with said second-surface member in said passage;

    an intake opening through which said coolant is taken in from an outside;

    an intake header configured to send said coolant entering from said intake opening to said first fin and said second fin;

    a discharge opening through which said coolant is discharged to said outside; and

    a discharge header configured to send, to said discharge opening, said coolant passing through said first fin and said second fin, andwherein said first power module and said second power module face each other through said first-surface member and said second-surface member, and through said first fin and said second fin.

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